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OPC pattern generation method

A graphics generation and graphics technology, which is applied to the photoplate making process, optics, and instruments of the patterned surface, can solve problems such as error-prone and time-consuming, and achieve the effect of improving the generation speed and accuracy and optimizing the simulation results

Active Publication Date: 2020-06-09
SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the process of generating OPC test patterns is basically a manual process, which takes a lot of time and is prone to errors. It is difficult to meet the needs of generating a large number of OPC test patterns in a short time

Method used

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Embodiment Construction

[0036] The technical solutions in this application will be clearly and completely described below in conjunction with the accompanying drawings. Apparently, the described embodiments are part of the embodiments of this application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0037] In the description of this application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, use a specific orientati...

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Abstract

The invention discloses an OPC pattern generation method, and relates to the technical field of semiconductor photoetching. The method comprises the steps of generating a basic pattern generation library, wherein the basic pattern generation library is used for generating basic patterns, and the shapes of the basic patterns comprise line patterns and hole patterns; calling the basic pattern generation library, generating basic patterns according to a predetermined design pattern, and combining the basic patterns to generate an initial OPC pattern; determining the size of a to-be-added head pattern by utilizing a weighting function and a line end position in the initial OPC pattern, wherein the weighting function is used for calculating the weight of a line end; and adding a corresponding head pattern to the line end in the initial OPC pattern according to the size of the to-be-added head pattern to obtain a target OPC pattern. The problems of low efficiency and high error rate of generating a large number of OPC patterns at present are solved; and the effects of automatically generating the OPC pattern, optimizing the simulation result of the OPC pattern and improving the generation speed and accuracy of the OPC pattern are achieved.

Description

technical field [0001] The present application relates to the technical field of semiconductor lithography, and in particular to a method for generating OPC patterns. Background technique [0002] In semiconductor manufacturing, as the design size continues to shrink, the diffraction effect of light becomes more and more obvious, resulting in the actual pattern formed by photolithography on the silicon wafer becoming different from the design pattern. In order to correct this phenomenon, OPC (optical proximity correction, optical proximity effect correction) was created to make the pattern after photolithography close to the design pattern. [0003] During the modeling and testing process, it is necessary to continuously measure and modify the OPC test pattern and photolithography pattern. At present, the process of generating OPC test patterns is basically a manual process, which takes a lot of time and is prone to errors. It is difficult to meet the needs of generating a ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G03F1/36
CPCG03F1/36
Inventor 王聪玉金晓亮
Owner SHANGHAI HUAHONG GRACE SEMICON MFG CORP
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