Wire cutting device and material cutting equipment

A wire cutting and material technology, applied in the field of online cutting device and material cutting equipment, can solve the problems of raw stone material waste, high cutting resistance, and low cutting efficiency, and achieve the effects of alleviating material waste, low cutting resistance, and high cutting efficiency

Pending Publication Date: 2020-06-12
深圳市威雄精机有限公司
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  • Abstract
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  • Claims
  • Application Information

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Problems solved by technology

[0003] The purpose of the embodiments of the present invention is to provide a wire cutting device and material cutting equipment to solve the problems of large cutting resistance, low cutting efficiency, large cutting kerf, and serious waste of raw stone materials in the prior art when using a hacksaw or a band saw to cut rough stones. technical problem

Method used

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  • Wire cutting device and material cutting equipment
  • Wire cutting device and material cutting equipment
  • Wire cutting device and material cutting equipment

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Embodiment Construction

[0043] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention clearer, the following in conjunction with the appended Figure 1-5 And embodiment, the present invention is described in further detail. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0044] It should be noted that when an element is referred to as being “fixed” or “disposed on” another element, it may be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or indirectly connected to the other element.

[0045] It is to be understood that the terms "length", "width", "top", "bottom", "front", "rear", "left", "right", "vertical", "horizontal", "top" , "bottom", "inner", "outer" and other indicated orientati...

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Abstract

The invention belongs to the technical field of material cutting and particularly relates to a wire cutting device and material cutting equipment. The wire cutting device comprises a mounting rack anda wire cutting mechanism. The mounting rack is provided with a material placement table, and the wire cutting mechanism comprises a cutting wire, a paying-off assembly, a take-up assembly and a cutting driving assembly. The paying-off assembly and the take-up assembly are arranged on the two sides of the material placement table respectively and connected with the two ends of the cutting wire respectively, a wire cutting segment is formed on the portion, between the paying-off assembly and the take-up assembly, of the cutting wire, the cutting driving assembly is in driving connection with the wire cutting segment, and when the cutting driving assembly drives the wire cutting segment to move until the wire cutting segment abuts against a material, the paying-off assembly and the take-up assembly execute paying-off and take-up actions, so that the wire cutting segment rubs and cuts the material. The contact area between the cutting wire and the material is smaller when the cutting wirecuts the material, the cutting resistance is smaller, the cutting efficiency is higher, in addition, a cutting edge of the cutting wire is relatively small, less waste is generated during cutting, material waste can be effectively reduced, and the production cost is lowered.

Description

technical field [0001] The invention belongs to the technical field of material cutting, and more specifically relates to a wire cutting device and material cutting equipment. Background technique [0002] Rough stone cutting is an essential link in the rough stone processing process. In the existing rough stone processing workshop, large steel tooth saws or band saws are often used to cut rough stones. The thickness of the hacksaw or band saw is generally relatively large, mostly about 5mm, to ensure that the strength and rigidity of the hacksaw or band saw can meet the cutting requirements of rough stones. The cutting contact area is large and the cutting resistance is large, which makes it difficult to improve the cutting efficiency. In addition, a large rough stone often needs to be cut into smaller stones many times to make different products. Due to the thickness of the hacksaw or band saw, it will produce a large cut when cutting the rough stone, so , the more times...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B28D1/06B28D7/00B28D7/04
CPCB28D1/06B28D7/005B28D7/04
Inventor 叶民崇刘庆李军旗王小东杨虎聂炎黄伟
Owner 深圳市威雄精机有限公司
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