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Integrated circuit capable of simultaneously preparing multi-channel high-precision operational amplifiers

An operational amplifier circuit, operational amplifier technology, applied in differential amplifiers, DC-coupled DC amplifiers, etc., can solve the problems of clock signal frequency deviation, affecting work, and inability to effectively prepare high-precision operational amplifiers at the same time, to achieve a wide range of applications, cost reduction effect

Pending Publication Date: 2020-06-16
JIANGSU RUNIC TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In the process of integrated circuits, a single-channel high-precision operational amplifier can be directly packaged to obtain a dual-channel high-precision operational amplifier. At this time, there are two oscillator units in the obtained dual-channel high-precision operational amplifier. Generally, The frequency of the clock signal generated by the two oscillator units deviates, resulting in the intermodulation of the two oscillator units in the dual-channel high-precision operational amplifier obtained from the single-channel high-precision operational amplifier, which will cause interference and affect the packaging. Get a working dual-channel high-precision op amp
[0004] In order to ensure the working reliability of the dual-channel high-precision operational amplifier, the process of the dual-channel precision operational amplifier can be directly designed in the integrated circuit design, and the dual-channel high-precision operational amplifier obtained during packaging has only one oscillator unit, that is, this When the dual-channel high-precision operational amplifier and the single-channel high-precision operational amplifier use two sets of independent masks, two sets of independent integrated circuit designs are respectively carried out. Therefore, it is impossible to obtain a single-channel operational amplifier by using the integrated circuit package in this state. Will increase design and manufacturing costs
[0005] For the integrated circuit design where the single-channel high-precision operational amplifier and the dual-channel high-precision operational amplifier share a set of mask plates, it is necessary to modify one of the mask plates at the end. In this case, it can be realized by modifying the mask plate. Packaging and manufacturing of single-channel high-precision operational amplifiers or dual-channel high-precision operational amplifiers, but modifying the mask will also increase design and manufacturing costs
In addition, for a dual-channel high-precision operational amplifier packaged by a single-channel high-precision operational amplifier, the oscillator unit in the dual-channel high-precision operational amplifier can also be set by wire bonding during packaging to ensure dual-channel high-precision The operational reliability of the operational amplifier; but the way of wiring will also increase the cost
[0006] Those skilled in the art know that, similar to the relationship between the above-mentioned dual-channel high-precision operational amplifiers and single-channel high-precision operational amplifiers, the four-channel high-precision operational amplifiers and dual-channel high-precision operational amplifiers also have the same problems mentioned above when they are packaged and manufactured. , that is, it is impossible to effectively prepare high-precision operational amplifiers with different channels at the same time without significantly increasing the design and manufacturing costs.

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  • Integrated circuit capable of simultaneously preparing multi-channel high-precision operational amplifiers
  • Integrated circuit capable of simultaneously preparing multi-channel high-precision operational amplifiers
  • Integrated circuit capable of simultaneously preparing multi-channel high-precision operational amplifiers

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Embodiment Construction

[0027] The present invention will be further described below in conjunction with specific drawings and embodiments.

[0028] Such as figure 1 and figure 2 Shown: In order to realize the packaging and manufacturing of high-precision operational amplifiers with required channels and reduce the cost of packaging and manufacturing, the present invention includes a wafer body 1 and a number of operational amplifier unit blocks 6 prepared on the wafer body 1. The operational amplifier unit block 6 includes two operational amplifier unit bodies and a scribe lane 4 for separating the operational amplifier unit bodies, and the operational amplifier unit bodies are located on both sides of the scribe lane 4; including an operational amplifier circuit and an oscillator circuit adapted to the operational amplifier circuit;

[0029] In each operational amplifier unit block 6, an inter-unit oscillator signal processing circuit is also set, and in the operational amplifier unit block 6, a...

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Abstract

The invention relates to an integrated circuit capable of simultaneously preparing multi-channel high-precision operational amplifiers. When an operational amplifier unit block is integrally packaged,a reference oscillator circuit is selected as an oscillator unit of a high-precision operational amplifier through an inter-unit oscillator signal processing circuit, so that the high-precision operational amplifier performs required operational amplification according to the oscillator signal of the selected oscillator unit; the operational amplifier unit bodies in the operational amplifier unitblocks are cut and packaged respectively by using the scribing channels; a reference unit high-precision operational amplifier and a non-reference unit high-precision operational amplifier can be obtained at the same time; the reference unit high-precision operational amplifier performs required operational amplification according to the oscillator signal of the reference oscillator circuit; thenon-reference unit high-precision operational amplifier performs required operational amplification according to the oscillator signal of the non-reference oscillator circuit, can realize different channel package manufacturing of the required high-precision operational amplifier, reduces the package manufacturing cost, and is safe and reliable.

Description

technical field [0001] The invention relates to an integrated circuit, in particular to an integrated circuit capable of simultaneously preparing multiple channels of high-precision operational amplifiers, and belongs to the technical field of high-precision operational amplifiers. Background technique [0002] Operational amplifiers (Operational Amplifiers) are widely used in integrated circuits, and commonly used operational amplifiers generally include single-channel operational amplifiers, dual-channel operational amplifiers and four-channel operational amplifiers. [0003] At present, high-precision operational amplifiers are generally prepared in the form of integrated circuits. For high-precision operational amplifiers, it also includes an oscillator unit that can generate clock signals, that is, there is at least one oscillator unit in each high-precision operational amplifier; such as in design, it can be used in single-channel high-precision operational amplifiers,...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03F3/45
CPCH03F3/45
Inventor 张明马学龙焦炜杰杨金群石方敏
Owner JIANGSU RUNIC TECH CO LTD