Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Bendable PCB

A technology for PCB boards and PCB motherboards, which is applied to circuit substrate materials, structural connections of printed circuits, printed circuit components, etc. The practicability and other issues of the board are solved to solve the poor moisture-proof and anti-corrosion effects, improve the anti-leakage effect, and improve the anti-corrosion effect.

Active Publication Date: 2020-06-19
万安裕维电子股份有限公司
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] There are certain defects in the current PCB boards. The lack of the rotation and fixing mechanism of the first PCB main board and the second PCB main board makes it inconvenient to fold and install the PCB board, thereby reducing the practicability of the PCB board. At the same time, it lacks convenient disassembly and assembly functions, causing inconvenience Disassemble and maintain the PCB main board 1 or PCB main board 2, and the moisture-proof and anti-corrosion effect of the PCB board is not good

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Bendable PCB
  • Bendable PCB
  • Bendable PCB

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0029] In order to make the purpose, features and advantages of the present invention more obvious and understandable, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the following The described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0030] The technical solutions of the present invention are further described below with reference to the accompanying drawings and through specific embodiments.

[0031] In the description of the present invention, it should be understood that the orientations or positional relationships indicated by the terms "upper", "lower", "top",...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a bendable PCB which comprises a PCB main board I, a PCB main board II, mounting plates, a rotating pin, a ball, a rotating rod, a circular groove, a flat head fastening bolt,a fixed plate, a hinge, a magnetic block I, a magnetic block II, an arc groove, an arc rod, an anti-corrosion coating, a substrate, an insulating plate, a damp-proof layer and a heat dissipation layer. The PCB mainboard II is rotated, the PCB mainboard II rotates to drive the rotating rod to rotate around the rotating pin; when the PCB main board II rotates to a proper position, the flat head fastening bolt is screwed and then the rotating pin is fixed and the position of the PCB main board II is fixed; the two mounting plates are rotated by the hinge; the mounting plates rotate to drive the magnetic block II to rotate to be attached to the magnetic block I; the mounting plates rotate to drive the arc rod to move into the arc groove, the arc rod moves to extrude the conical block, the conical block is extruded to move to extrude the spring, the elastic force of the spring facilitates the conical block to reversely move into the V-shaped groove, then the arc rod is clamped into the arcgroove, and mounting of the mounting plates is completed.

Description

technical field [0001] The invention relates to a PCB board, in particular to a bendable PCB board, and belongs to the technical field of PCB boards. Background technique [0002] A printed circuit board, also known as a printed circuit board, is a provider of electrical connections for electronic components. Its development has a history of more than 100 years. Its design is mainly layout design. The main advantage of using circuit boards is to greatly reduce wiring and assembly errors, and improve the automation level and production labor rate. [0003] The currently used PCB board has certain defects. It lacks the rotation and fixing mechanism of the first and second PCB boards, which makes it inconvenient to fold and install the PCB board, thereby reducing the practicability of the PCB board. The disassembly and maintenance of PCB main board 1 or PCB main board 2 is not effective in preventing moisture and corrosion of the PCB board. Therefore, a bendable PCB board is ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/14H05K1/02H05K1/03
CPCH05K1/02H05K1/0313H05K1/0353H05K1/036H05K1/148
Inventor 谢润鹏
Owner 万安裕维电子股份有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com