Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Explosion-proof plate manufacturing method of thick plate and thick copper plate, thick plate and thick copper plate

A production method and thick copper plate technology, applied in explosion-proof plate production, thick copper plate, and thick plate fields, to achieve the effects of reducing production costs, improving pass rate, and reducing the problem of delaminated explosion plates

Active Publication Date: 2020-06-19
SHENZHEN SUNTAK MULTILAYER PCB
View PDF3 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims at the problem of the above-mentioned defects in the existing stepped plate, and provides a method for manufacturing an explosion-proof plate of a thick plate and a thick copper plate, as well as a thick plate and a thick copper plate. Improve the pass rate and reduce the production cost

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Explosion-proof plate manufacturing method of thick plate and thick copper plate, thick plate and thick copper plate
  • Explosion-proof plate manufacturing method of thick plate and thick copper plate, thick plate and thick copper plate
  • Explosion-proof plate manufacturing method of thick plate and thick copper plate, thick plate and thick copper plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] A method for manufacturing a circuit board with a plate thickness ≥ 5 mm shown in this embodiment includes the following processing steps in sequence:

[0047] (1) Cutting: Cut out the core board, PP sheet and outer layer copper foil according to the board size 320mm×420mm. The thickness of the core board is 0.15mm (this thickness is the thickness without copper), and the outer layer of the core board The thickness of the copper surface is 1OZ; the core board is specifically made of Lianmao IT180A sheet material.

[0048] (2) Baking: Bake the core board at 180°C for 4 hours, the resin in the core board will be completely melted by baking, the core board can be cured better, and the stress in the board can be released to ensure the size of the core board stability.

[0049] (3), making the inner layer circuit (negative film process): on the core plate, use a vertical coating machine to coat a photosensitive film, the film thickness of the photosensitive film is controll...

Embodiment 2

[0072] A kind of manufacturing method of the thick copper plate of inner layer copper thickness ≥ 4OZ shown in this embodiment, comprises following processing steps successively:

[0073] (1) Cutting: Cut out the core board, PP sheet and outer layer copper foil according to the board size 320mm×420mm. The thickness of the core board is 0.11mm (this thickness is the thickness without copper), and the outer layer of the core board The thickness of the copper surface is 4OZ; the core board is specifically made of Lianmao IT180A sheet material.

[0074] (2) Baking: Bake the core board at 180°C for 4 hours, the resin in the core board will be completely melted by baking, the core board can be cured better, and the stress in the board can be released to ensure the size of the core board stability.

[0075] (3), making the inner layer circuit (negative film process): on the core plate, use a vertical coating machine to coat a photosensitive film, the film thickness of the photosensi...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Plate thicknessaaaaaaaaaa
Login to View More

Abstract

The invention discloses an explosion-proof plate manufacturing method of a thick plate and a thick copper plate, and the thick plate and the thick copper plate. The method comprises the following steps: baking a production plate before drilling on the production plate after a pressing process is completed; drilling a hole in the production plate; continuously baking the production plate after drilling; then, carrying out copper deposition, full-board electroplating and outer-layer circuit manufacturing on the production plate, and then baking the production plate is baked before solder resisting; and finally, sequentially carrying out solder mask layer manufacturing, surface treatment and forming procedures on the production plate to obtain the thick plate or the thick copper plate. The method provided by the invention can effectively reduce the problem of abnormal plate explosion in the production process, the percent of pass is improved, and the production cost is reduced.

Description

technical field [0001] The invention relates to the technical field of manufacturing printed circuit boards, in particular to a method for manufacturing an explosion-proof plate of a thick plate and a thick copper plate, and the thick plate and thick copper plate. Background technique [0002] At present, the process of making a platform on a printed circuit board is: forming an inner layer board through material cutting, inner layer pattern transfer and etching; pressing each inner layer board to form a multi-layer board; and then drilling and sinking the multi-layer board Copper, full board electroplating, outer layer graphics, graphic electroplating, outer layer etching and coating solder resist layer to form a multilayer circuit board with outer layer circuits, and finally surface treatment, molding, and final inspection to produce finished products . [0003] Through the existing method, when producing thick plates with a plate thickness of 5.0mm or more or thick coppe...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/00H05K3/02H05K3/28H05K3/46
CPCH05K3/0044H05K3/0047H05K3/02H05K3/282H05K3/4611
Inventor 孙保玉姜雪飞宋建远季辉
Owner SHENZHEN SUNTAK MULTILAYER PCB
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com