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A kind of explosion-proof plate manufacturing method of thick plate, thick copper plate and thick plate, thick copper plate

A production method and thick copper plate technology, applied in multilayer circuit manufacturing, printed circuit manufacturing, printed circuit, etc., to achieve the effect of improving the pass rate, reducing production costs, and reducing the problem of delamination explosion

Active Publication Date: 2021-06-15
SHENZHEN SUNTAK MULTILAYER PCB
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims at the problem of the above-mentioned defects in the existing stepped plate, and provides a method for manufacturing an explosion-proof plate of a thick plate and a thick copper plate, as well as a thick plate and a thick copper plate. Improve the pass rate and reduce the production cost

Method used

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  • A kind of explosion-proof plate manufacturing method of thick plate, thick copper plate and thick plate, thick copper plate
  • A kind of explosion-proof plate manufacturing method of thick plate, thick copper plate and thick plate, thick copper plate
  • A kind of explosion-proof plate manufacturing method of thick plate, thick copper plate and thick plate, thick copper plate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] The method of fabricating a plate thickness ≥ 5 mm shown in the present embodiment, including the following processing step:

[0047] (1), the opening: The core plate and the PP sheet and the outer copper foil are opened by the puzzle size of 320 mm × 420mm. The core panel thickness is 0.15 mm (the thickness of the thickness is not copper), the outer layer of the core plate The copper surface has a thickness of 1OZ; the core panel is specifically used in the Sheet IT180A sheet.

[0048] (2), bake: Place the core plate at 180 ° C for 4h, by baking to completely melt the resin in the core plate, the core plate can be better cured, and the stress in the plate is released to ensure the core plate size. Stability.

[0049] (3), fabricate the inner line (negative sheet process): Apply a photosensitive film with a vertical coating machine on the core plate, the film thickness of the photosensitive film controls 8 μm, using a fully automatic exposure machine, exposed 5-6 exposure (...

Embodiment 2

[0072] In this example, the inner layer copper thickness ≥ 4Oz thick copper plate is made, including the following treatment step:

[0073] (1) The thickness of the copper surface is 4OZ; the core panel is specifically used in Liamao IT180A sheet.

[0074] (2), bake: Place the core plate at 180 ° C for 4h, by baking to completely melt the resin in the core plate, the core plate can be better cured, and the stress in the plate is released to ensure the core plate size. Stability.

[0075] (3), fabricate the inner line (negative sheet process): Apply a photosensitive film with a vertical coating machine on the core plate, the film thickness of the photosensitive film controls 8 μm, using a fully automatic exposure machine, exposed 5-6 exposure (21 The lattice exposure is completed in the inner layer line exposure; inner layer etching, in the core plate after exposure development, the inner layer line is measured to 3 mil; the inner layer AOI, then check the inside of the inner layer...

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Abstract

The invention discloses a method for manufacturing an explosion-proof plate of a thick plate and a thick copper plate, and the thick plate and thick copper plate. The method comprises the following steps: before drilling holes on the production plate that has completed the lamination process, firstly baking the production plate ; Then drill holes on the production board; continue to bake the production board after drilling; then carry out copper sinking, full board electroplating and make outer layer circuits on the production board, and then bake the production board before solder mask ; Finally, the processes of making solder resist layer, surface treatment and molding are carried out on the production board in turn to obtain a thick plate or thick copper plate. The method of the invention can effectively reduce the problem of abnormal plate bursting in the production process, improve the qualified rate and reduce the production cost.

Description

Technical field [0001] The present invention relates to the field of production of printed circuit boards, and more particularly to an explosion-proof sheet for a thick plate, a thick copper plate and a thick plate, thick copper plate. Background technique [0002] At present, the process of making the platform on the printed circuit board is: forming an inner layer plate by opening, inner layer graphic transfer, and etching; pressing each of the layers to form a multilayer plate; then drilled the multi-layer plate, sink Copper, all-plate electroplating, outer graphics, graphic electroplating, outer layer etching and coating soldering layers form a multilayer circuit board having an outer layer line, and finally perform surface treatment, molding, and then finalized product. . [0003] When the existing method is produced by thick copper plates of the thick plate or the inner copper thickness of 5.0 mm thickness of the plate thickness, the inner layer is often detected in the shi...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/02H05K3/28H05K3/46
CPCH05K3/0044H05K3/0047H05K3/02H05K3/282H05K3/4611
Inventor 孙保玉姜雪飞宋建远季辉
Owner SHENZHEN SUNTAK MULTILAYER PCB
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