Production method of replacement embedded copper block of circuit board

Abstract

The invention discloses a production method of a replacement embedded copper block of a circuit board. The production method comprises steps that a target hole is drilled in a production board after early stage stitching, and a through hole is drilled in the position of the target hole; glue refuses on the production board are removed by adopting plasma glue removing operation, and the through hole is metalized by adopting an electroless plating copper and full board electroplating operation; the copper (electro)plating bridging of the middle position of the metalized through hole is carried out by adopting an pulse plating bridging operation, and then a double-sided blind hole is formed; the copper (electro)plating is carried out in the double-sided blind hole to fill and level up the double-sided blind hole by adopting a full board filling electroplating operation; the circuit board is produced by sequentially carrying out the drilling operation, the electroless plating copper operation, the full board electroplating operation, and other latter operations on the production board. A metal copper block is formed on the production board in an electroplated way to replace a conventional high heat conduction metal copper block or a metal block embedded in the circuit board, and the problems of the circuit board such as poor reliability and delamination and blistering caused by the filling of the metal block product are solved, and therefore the production efficiency of the circuit board, a rejection rate is reduced, and the excellent heat dissipation performance of the product is guaranteed.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a production method for replacing buried copper blocks in circuit boards. Background technique [0002] With the rapid development of electronic products in the direction of light, thin, small, high density, and multi-function, the volume of electronic components and logic circuits has been reduced exponentially, while the operating frequency has increased sharply and power consumption has continued to increase, resulting in the working environment of components. Changes in the direction of high temperature have put forward higher and higher requirements for the heat dissipation of PCB products. If there is no good heat dissipation method to eliminate the heat generated by electrons, these excessively high temperatures will cause electronic components to generate electron ionization and thermal stress. Resulting in reduced overall stability and shortened ...

AI Technical Summary

Problems solved by technology

[0007] The present invention aims at the problems of embedding high thermal conductivity metal copper blocks or other metal blocks in the existing high heat dissipation circuit boards for heat dissipation, resulting in inability to batch production, low production efficiency, high scrap rate and high production cost, and provides a circuit board Substituting the production method of buried copper blocks, this method provides a technical solution for embedding high thermal conductivity metal copper blocks or metal blocks in circuit boards, and solves the problems of poor reliability and delamination of circuit boards caused by filling metal block products ; And it can be mass-produced, which improves the production efficiency of the circuit board, reduces the scrap rate and thus reduces the production cost, and at the same time can ensure the excellent heat dissipation performance of the product

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