A kind of preparation method of laminated board

A technology of lamination and thermoforming, applied in the direction of lamination, lamination equipment, chemical instruments and methods, etc., can solve the problems of high density of glue formula filler, high thermal conductivity, increase the thickness of multi-layer boards, etc., to achieve flexibility Distribution state, good economic benefits, and the effect of improving the infiltration effect
CN104191794BActive Publication Date: 2015-12-30SHENGYI TECH SUZHOU
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHENGYI TECH SUZHOU
Publication Date
2015-12-30

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Abstract

The invention discloses a method for manufacturing a laminated board. The method for manufacturing the laminated board comprises the following steps: (1) adding a filler into thermosetting resin to obtain a resin composition, dissolving the resin composition with a solvent to obtain glue, and directly combining the glue, a reinforcing material and a metal foil to obtain a combined module, wherein the filler comprises a charged filler and a non-charged filler; (2) performing hot forming on the combined module to obtain the laminated board, wherein in the hot forming process of the combined module, the combined module is always in an electrical field. In the method, the charged filler is added into a glue formulation of the laminated board, and in the laminating process, the electrical field is used for manufacturing the laminated board, so that the problem of hierarchical burst of the laminated board caused by too large diffidence of thermal expansion coefficients and thermal conductivity coefficients of the resin and a copper foil is solved; experiments show that the defective rate, caused by the hierarchical burst, of the laminated board manufactured by the invention method is 0%, so that the problem of the hierarchical burst is solved.
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Description

technical field

[0001] The invention relates to a preparation method of a laminated board, which belongs to the technical field of electronic materials. Background technique

[0002] With the development of the electrical industry, copper clad laminates for printed circuits have also achieved rapid development. The problem in the traditional multilayer board manufacturing process with thick copper structure is: the huge difference in thermal conductivity between copper foil and resin makes the surface resin accumulate a lot of heat under thermal shock, and the thermal expansion coefficients of resin and copper foil are inconsistent. As a result, a huge tensile stress is generated between the copper foil and its adjacent layer of resin due to the difference in expansion. When the tensile stress exceeds the bonding force between the resin and the copper foil, a macroscopic layer explosion occurs.

[0003] In view of the above problems, in order to reduce delamination explosio...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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