A kind of preparation method of laminated board

Abstract

The invention discloses a method for manufacturing a laminated board. The method for manufacturing the laminated board comprises the following steps: (1) adding a filler into thermosetting resin to obtain a resin composition, dissolving the resin composition with a solvent to obtain glue, and directly combining the glue, a reinforcing material and a metal foil to obtain a combined module, wherein the filler comprises a charged filler and a non-charged filler; (2) performing hot forming on the combined module to obtain the laminated board, wherein in the hot forming process of the combined module, the combined module is always in an electrical field. In the method, the charged filler is added into a glue formulation of the laminated board, and in the laminating process, the electrical field is used for manufacturing the laminated board, so that the problem of hierarchical burst of the laminated board caused by too large diffidence of thermal expansion coefficients and thermal conductivity coefficients of the resin and a copper foil is solved; experiments show that the defective rate, caused by the hierarchical burst, of the laminated board manufactured by the invention method is 0%, so that the problem of the hierarchical burst is solved.

Description

technical field [0001] The invention relates to a preparation method of a laminated board, which belongs to the technical field of electronic materials. Background technique [0002] With the development of the electrical industry, copper clad laminates for printed circuits have also achieved rapid development. The problem in the traditional multilayer board manufacturing process with thick copper structure is: the huge difference in thermal conductivity between copper foil and resin makes the surface resin accumulate a lot of heat under thermal shock, and the thermal expansion coefficients of resin and copper foil are inconsistent. As a result, a huge tensile stress is generated between the copper foil and its adjacent layer of resin due to the difference in expansion. When the tensile stress exceeds the bonding force between the resin and the copper foil, a macroscopic layer explosion occurs. [0003] In view of the above problems, in order to reduce delamination explosio...

AI Technical Summary

Problems solved by technology

The problem in the traditional multilayer board manufacturing process with thick copper structure is: the huge difference in thermal conductivity between copper foil and resin makes the surface resin accumulate a lot of heat under thermal shock, and the thermal expansion coefficients of resin and copper foil are inconsistent. As a result, a huge tensile stress is generated between the copper foil and its adjacent layer of resin due to the difference in expansion. When the tensile stress exceeds the bonding force between the resin and the copper foil, a layered explosion on the macroscopic surface is produced.

[0004] However, although the first method can slightly reduce the probability of delamination, it is easy to delaminate at the interface due to insufficient bonding force due to the limited bonding force between the organic dielectric layer and copper foil and resin; in addition, this The method significantly increases the thickness of the multilayer board, which is not suitable for PCB products with strict thickness tolerance requirements; at the same time, the organic dielectric layer with high thermal conductivity uses special materials with high thermal conductivity, and the material cost is very high, which does not have economic benefits

In the second method, because the thermal expansion coefficient of the filler is small, increasing the proportion of the filler can reduce the overall thermal expansion coefficient of the resin, thereby reducing the differential stress of thermal expansion and reducing delamination; however, since the filler is evenly distributed in the laminate Internally, if the surface layer resin has a large filler distribution density, it is necessary to greatly increase the total filler addition ratio; and the consequence of this approach is that the glue formula filler density is too high, and the semi-cured production process is difficult to achieve, even if the production The prepreg with such a high filler ratio will also face the problem of uneven filler distribution in the laminate; at the same time, the multilayer circuit board will have poor processing adaptability due to the brittleness of the board; however, in this method, When the thermosetting resin is based on 100 parts, the filler content must be more than 100 parts. If the filler is added less, the effect of reducing delamination and bursting will not be achieved.

[0005] For manufacturers of printed circuit boards, how to produce multilayer boards with thick copper structures that can meet the reliability requirements of multilayer printed circuit boards such as electrical, mechanical, and heat resistance, while avoiding the The delamination explosion caused by the difference in thermal conductivity and thermal expansion coefficient between resin and copper foil has become a goal that those skilled in the art have been eager to achieve but have not been able to solve well.

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