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Method for improving circuit board explosion and copper sheet blistering and circuit board

A circuit board and explosion board technology is applied in the field of circuit board explosion board and printed circuit board production to achieve the effects of reducing production costs, optimizing pressing parameters, and solving the problems of layered explosion boards and copper skin blistering

Pending Publication Date: 2020-09-08
DALIAN CHONGDA CIRCUIT +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The present invention aims at the problem of the above-mentioned defects in the existing stepped board, and provides an improvement method for circuit board cracking and copper skin blistering, which can effectively reduce abnormal problems such as cracking boards and copper skin blistering in the production process, and improve Improve the pass rate and reduce the production cost

Method used

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  • Method for improving circuit board explosion and copper sheet blistering and circuit board

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Experimental program
Comparison scheme
Effect test

Embodiment

[0038] A method for manufacturing a circuit board shown in this embodiment includes the following processing steps in sequence:

[0039] (1) Cutting: Cut out the core board, PP and outer layer copper foil according to the panel size of 520mm×620mm. The thickness of the core board is 0.15mm (this thickness is the thickness without copper), and the outer layer copper The surface thickness is 0.5OZ.

[0040] (2) Baking: Bake the core board at 180°C for 4 hours, the resin in the core board will be completely melted by baking, the core board can be cured better, and the stress in the board can be released to ensure the size of the core board stability.

[0041] (3), making the inner layer circuit (negative film process): on the core plate, use a vertical coating machine to coat a photosensitive film, the film thickness of the photosensitive film is controlled at 8 μm, and a fully automatic exposure machine is used to expose the ruler with 5-6 grids (21 grid exposure ruler) to com...

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Abstract

The invention discloses a method for improving circuit board explosion and copper sheet blistering and a circuit board. The method comprises the following steps of: forming a core board, PP and outer-layer copper foil according to the size of a jointed board; manufacturing an inner-layer circuit on the core plate by adopting a negative film process; carrying out dehumidification treatment on the PP; laminating the outer-layer copper foil PP and the core plate in sequence according to a plate arrangement sequence, and then laminating to form a production board; drilling a hole in the productionboard; baking the production board after drilling; carrying out plasma degumming treatment on the production board; and then carrying out copper deposition, full-board electroplating, outer-layer circuit manufacturing, solder mask layer manufacturing, surface treatment and forming procedures on the production board to obtain the circuit board. The method provided by the invention can effectivelyreduce the problem of abnormal plate explosion in the production process, improves the percent of pass and reduces the production cost.

Description

technical field [0001] The invention relates to the technical field of printed circuit board production, in particular to a method for improving circuit board cracking and copper skin blistering and a circuit board. Background technique [0002] At present, the process of making a platform on a printed circuit board is: forming an inner layer board through material cutting, inner layer pattern transfer and etching; pressing each inner layer board to form a multi-layer board; and then drilling and sinking the multi-layer board Copper, full board electroplating, outer layer graphics, graphic electroplating, outer layer etching and coating solder resist layer to form a multilayer circuit board with outer layer circuits, and finally surface treatment, molding, and final inspection to produce finished products . [0003] When using the above-mentioned existing methods to produce circuit boards, problems such as board explosion and copper skin blistering often occur, resulting in...

Claims

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Application Information

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IPC IPC(8): H05K3/00H05K3/26H05K3/46
CPCH05K3/0047H05K3/0055H05K3/46H05K3/26H05K2203/068H05K2203/085H05K2203/1105H05K2203/1194
Inventor 孙保玉宋建远季辉孙淼
Owner DALIAN CHONGDA CIRCUIT
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