Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Mobile phone control chip packaging method

A technology for controlling chips and packaging methods, applied in the direction of electrical components, electrical components, etc., can solve the problems of circuit board packaging with various specifications, no glue coating method, sophisticated equipment, etc., to avoid errors, avoid waste of silica gel, Equipment composed of simple effects

Inactive Publication Date: 2020-06-23
深圳市斯奈尔科技有限公司
View PDF10 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The mobile phone chip is the brain of the smart phone. In the process of producing mobile phones, the control chip needs to be packaged on the mobile phone circuit board. At present, the chip packaging method still adopts the traditional method. The required equipment is sophisticated and costly, and the steps are relatively cumbersome. Moreover, there is no reasonable way to apply glue in the packaging process, which is a waste of glue. In addition, the existing packaging equipment cannot package circuit boards of various specifications.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Mobile phone control chip packaging method
  • Mobile phone control chip packaging method
  • Mobile phone control chip packaging method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0043] see Figure 1-5 , a mobile phone control chip packaging method, comprising a circuit board, a conveyor belt 4, a clamp 5, a negative pressure suction cup 13, a gluing device 15 and an automatic welding arm 16, comprising the following steps:

[0044] S1, put the chip on the conveyor belt 4, and the conveyor belt 4 transfers the chip to the packaging station;

[0045] S2, placing the circuit board between the two clamps 5, and clamping it by the two clamps 5;

[0046] S3, the glue coating device 15 evenly coats the silica gel on the circuit board;

[0047] S4, the negative pressure suction cup 13 accurately places the chip on the silicon-coated circuit board;

[0048] S5, the automatic welding arm 16 welds the chip on the circuit board.

[0049] Please refer to Tu 2, including the workbench 1. The upper surface of the middle part of the workbench 1 is bonded with a backing plate 17, and the backing plate 17 is made of rubber. When the negative pressure suction cup 13 ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a mobile phone control chip packaging method, which belongs to the field of communication equipment production. A circuit board, a conveyor belt, a clamp, a negative pressure sucker, a gluing device and an automatic welding arm are included, and the mobile phone control chip packaging method comprises the following steps: S1, placing a chip on the conveyor belt, and conveying the chip to a packaging station by the conveyor belt; and S2, placing a circuit board between the two clamps, and clamping the circuit board by the two clamps. Rapid packaging of the mobile phonecontrol chip can be realized, the chip is accurately conveyed to the upper part of the mobile phone circuit board through the negative pressure sucker, the silica gel is uniformly coated on the circuit board by utilizing the rolling rod, silica gel can be prevented from being wasted, resources and cost are saved, then the chip is pressed on the position coated with the silica gel through the negative pressure suction cup, finally welding is conducted through the automatic welding arm, errors in the packaging process can be avoided through the packaging method, needed equipment is simple in composition, the procedure is simplified, the production cost is reduced, and the production efficiency is improved.

Description

technical field [0001] The invention relates to the field of communication equipment production, and more specifically relates to a packaging method for a control chip of a mobile phone. Background technique [0002] Smart phones, like personal computers, have an independent operating system. Most of them are large-screen phones, and they have touch capacitive screens, and some have resistive screens. They are powerful and practical. The general term for such a type of mobile phone that users can install programs provided by third-party service providers, including games, to continuously expand the functions of mobile phones through such programs, and to realize wireless network access through mobile communication networks. [0003] The mobile phone chip is the brain of the smart phone. In the process of producing mobile phones, the control chip needs to be packaged on the mobile phone circuit board. At present, the chip packaging method still adopts the traditional method. ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04H05K13/00
CPCH05K13/0069H05K13/0413H05K13/0465H05K13/0469H05K13/0409
Inventor 郑浩波
Owner 深圳市斯奈尔科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products