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Electronic device and manufacturing method thereof

A technology for electronic devices and manufacturing methods, which is applied to circuits, electrical components, electrical solid devices, etc., can solve the problems that flexible substrates are not easy to peel off, damage electronic component layers, and are not automated, and achieve the effect of good production yield.

Active Publication Date: 2020-06-26
HANNSTAR DISPLAY CORPORATION
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, when the flexible substrate is peeled off, the adsorption force between the flexible substrate and the carrier may cause the flexible substrate to be difficult to peel off, and may even damage the electronic component layer
Furthermore, although the peeling method by adding water and degassing can effectively improve the ability to peel off the flexible substrate, but this step is not yet automated, which tends to increase the overall manufacturing time

Method used

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  • Electronic device and manufacturing method thereof
  • Electronic device and manufacturing method thereof
  • Electronic device and manufacturing method thereof

Examples

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Embodiment Construction

[0047] Reference will now be made in detail to the exemplary embodiments of the present invention, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used in the drawings and description to refer to the same or like parts.

[0048] Figure 1A to Figure 1D It is a schematic cross-sectional view of a manufacturing method of an electronic device according to an embodiment of the present invention. This embodiment is a method of removing the flexible substrate required for manufacturing a flexible electronic device. First, please refer to Figure 1A , disposing the flexible substrate 100 on the carrier 200 . The flexible substrate 100 here is, for example: polyimide (polyimide, PI), polyethylene terephthalate (Polyethylene Terephthalate, PET), cycloolefin polymer (CyclicOlefin Polymer, COP), polycarbonate (Polycarbonate , PC), polymethylmethacrylate (PolymethylMethacrylate, PMMA), cycloolefin copolymer (Cyclic Ol...

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Abstract

The invention provides an electronic device and a manufacturing method thereof. The manufacturing method comprises the following steps: arranging a flexible substrate on a carrier plate; arranging theelement layer on the flexible substrate; performing a cutting process to form a cutting channel extending from the top surface of the flexible substrate to the upper surface of the carrier plate, wherein the cutting channel is located at the periphery of the flexible substrate; performing a lift-off process to lift the edge of the flexible substrate contacting the upper surface of the carrier plate from the cutting channel; carrying out a water injection procedure, and injecting water from the opened edge of the flexible substrate; performing a release process to peel the flexible substrate from the upper surface of the carrier plate. The electronic device is provided with a flexible substrate and an element layer. The element layer is disposed on the top surface of the flexible substrate. The flexible substrate is provided with a top surface and a bottom surface which are opposite to each other, side edges and chamfers. The side edges are adjacent to the bottom surface, and the chamfers are located at the junctions of the side edges and the bottom surface. And the chamfer is between 10 degrees and 80 degrees.

Description

technical field [0001] The invention relates to an electronic device and a manufacturing method thereof, in particular to a flexible electronic device and a manufacturing method thereof. Background technique [0002] When fabricating a flexible electronic device, firstly, the flexible substrate needs to be fixed on the carrier. Next, an electronic component layer is formed on the flexible substrate. Finally, the flexible substrate is peeled off from the carrier to complete the electronic device. However, when the flexible substrate is peeled off, the adsorption force between the flexible substrate and the carrier may cause the flexible substrate to be difficult to peel off, and may even damage the electronic component layer. Furthermore, although the peeling method by adding water and degassing can effectively improve the ability to peel off the flexible substrate, this step has not been automated at present, which tends to increase the overall manufacturing time. Therefo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/683
CPCH01L21/6835H01L2221/68386H01L2221/68381
Inventor 廖家彬庄尧智周玫伶
Owner HANNSTAR DISPLAY CORPORATION
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