A liquid-cooled data center cabinet

Abstract

The invention discloses a liquid-cooled data center cabinet and relates to the technical field of server hardware equipment. The cabinet includes a square box with an open upper end, and a number of coaming panels are arranged in the square box, and the coaming panels and the square box together form at least one middle partition box with an open upper end , the power distribution module and the network module are placed in the middle partition box, and the square box is located on the outside of the middle partition box, and a server vertically inserted into the square box is fixedly installed. A stirring device is provided in the square box below the middle partition box, the stirring device includes a mounting plate, and a stirring impeller and an avoidance hole for accommodating the server are arranged on the mounting plate. A liquid return pipe and a liquid supply pipe are respectively arranged on the upper and lower sides of the stirring device on the square box. The cabinet has the characteristics of high heat transfer coefficient and high heat transfer capacity as well as the uniform heat dissipation of the overall components of the server.

Description

technical field [0001] The invention relates to the technical field of server hardware equipment, in particular to a liquid-cooled data center cabinet. Background technique [0002] With the acceleration of technological innovation in my country's data center industry, the localization level of data centers and servers has been continuously improved, and more and more products have emerged. According to Moore's Law, the power consumption of server chips is increasing year by year. In the next two years, the power consumption of CPU chips will exceed 300W, and the power consumption of GPU chips will exceed 500W. Excessive chip power consumption leads to the use of air-cooled cooling methods, and it is difficult to completely dissipate the heat of the chip, which is easy to generate local hot spots, causing the server chip temperature to be too high, causing downtime and other hazards. Therefore, new cooling methods for servers and chips have become an important research topi...

AI Technical Summary

Problems solved by technology

The commonality of the two methods is that the liquid covers the entire server, the heat transfer is uniform, and the function of the server fan is completely omitted, which is more energy-saving. However, the liquid flows through the server at a slower rate and the convective heat transfer coefficient is small. For areas with high power density such as chips, heat transfer is difficult. Limited capacity, still prone to local hotspots

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