Chuck plate, chuck structure having chuck plate, and bonding device having chuck structure

Abstract

A chuck plate of a chuck structure is placed on a heating plate, supports a wafer on the upper surface thereof, transfers, to the wafer, heat generated by the heating plate such that the wafer is heated, and can have: vacuum holes penetrating the top and the bottom thereof in order to adsorb the wafer by vacuum force; and a vacuum groove, which is provided on the lower surface thereof such that the chuck plate is vacuum-adsorbed to the heating plate, and forms a space by being limited by the upper surface of the heating plate.

Description

technical field [0001] The present invention relates to a chuck plate, a chuck structure with the chuck plate, and a welding device with the chuck structure. More specifically, it relates to a chuck plate for fixing a wafer, with the chuck A plate chuck structure and a welding device having the chuck structure. Background technique [0002] Recently, in order to meet the demand for miniaturization of electronic components such as semiconductor packages, a technology of stacking a plurality of electronic components to form a stacked die package has been developed. [0003] The stacked die package can achieve high integration as a semiconductor package in which dies are stacked on a package substrate. The stacked die package is manufactured at a chip level or a wafer level. [0004] In order to fabricate a stacked die package at said die level or wafer level, perform the operations required to apply heat and pressure and solder die to die or die to die or die to die, the ope...

AI Technical Summary

Problems solved by technology

Therefore, the vacuum adsorption force at the edge of the chuck structure is relatively low, and the wafer cannot be completely attached to the chuck structure.

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