The invention provides a welding structure and a semiconductor part, and relates to the technical field of semiconductor equipment. The welding structure includes a cover plate and a bottom plate; thebottom plate has a first end face, grooves are arranged in the first end face, and two ends of the grooves penetrate through a side wall of the bottom plate, and the grooves and the first end face form openings; and the cover plate has a second end face, the first end face is arranged opposite to the second end face, the second end face is provided with bulges, the bulges can seal the openings, and a gap between the first end face and the second end face is provided for arrangement of a solder layer, and the cover plate and the bottom plate are welded through the solder layer. When the coverplate and bottom plate are welded, the solder layer is heated, pressure towards the bottom plate is applied to the cover plate , pressure towards the cover plate is applied to the bottom plate, sincethe bulges can seal the openings, the solder layer in the gap is prevented from flowing into the grooves, the solder between the cover plate and the bottom plate is prevented from being insufficient,the probability of poor welding is reduced, the blockage of a water channel or an air passage can also be prevented, and the welding quality of the welding structure is improved.