Focusing and leveling device, photolithography equipment and focusing and leveling method
A technology of focusing and leveling device and light, which is applied in micro-lithography exposure equipment, photomechanical equipment, photo-plate making process exposure device, etc., can solve the problems of large energy loss of transmitted waves, low transmittance, large chromatic aberration, etc. Achieve the effects of improving energy utilization, improving detection signal-to-noise ratio, and large selection space
Active Publication Date: 2021-11-19
SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD
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Problems solved by technology
However, in the current focusing and leveling devices, the transmission slit depends on the base material, which limits the transmission band. On the one hand, the current base material only has a high transmittance in the band 0.2 μm-1.25 μm. Others The transmittance of the wave band is low; on the other hand, when the wave band is greater than 0.3μm, the chromatic aberration is large
In addition, the transmission slit plate or the combination of transmission slit and prism also needs to consider the energy loss of the transmitted wave obliquely incident on the slit surface, when the light is incident on the transmission slit plate or the combination of transmission slit and prism at an angle greater than 80° When the components are used, the energy loss of the transmitted wave is large, which greatly reduces the detection signal-to-noise ratio of the focusing and leveling device
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[0042] The specific implementation manner of the present invention will be described in more detail below with reference to schematic diagrams. The advantages and features of the present invention will be more apparent from the following description. It should be noted that all the drawings are in a very simplified form and use imprecise scales, and are only used to facilitate and clearly assist the purpose of illustrating the embodiments of the present invention.
[0043] As mentioned in the background art, in the current focusing and leveling devices, the measurement marks are mostly arranged on the transmission slit plate or on the combination of the transmission slit and the prism. However, in the current focusing and leveling devices, the transmission slit needs to rely on the substrate material, which limits the transmission wavelength band. The substrate material requires stable physical and chemical properties. Fused silica is commonly used, which only has a high tran...
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Abstract
The invention relates to a focusing and leveling device, photolithographic equipment and a focusing and leveling method. The light emitted by a light source module is incident on a reflection slit unit through an illumination module, and then projected to the On a substrate, the light reflected by the substrate is imaged to the detection module through the imaging unit, and the detection module processes the received light to obtain position information of the substrate. The invention breaks through the dependence of the measurement mark on the slit material, and is beneficial to greatly improving the energy utilization rate of the focusing and leveling device and improving the detection signal-to-noise ratio.
Description
technical field [0001] The invention relates to the field of semiconductor equipment, in particular to a focusing and leveling device, photolithographic equipment and a focusing and leveling method. Background technique [0002] A projection lithography machine is a device that images a mask pattern on a substrate surface, glass substrate or LED through a projection objective lens. In order to ensure that the mask pattern can be exposed accurately, it is necessary to precisely control the substrate surface to be located at a specified position by a focusing and leveling device. By detecting the height and inclination information of the substrate surface in the exposure field of view to judge whether the substrate surface is correctly focused and leveled, further adjust the position of the workpiece table according to the measurement results, so that the substrate surface on the workpiece table is at the best focus of the projection objective lens plane. [0003] In order t...
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IPC IPC(8): G03F7/20G03F9/00
CPCG03F7/70258G03F7/7085G03F9/7026G03F9/7034
Inventor 毛静超徐荣伟庄亚政孙建超季桂林李淑蓉
Owner SHANGHAI MICRO ELECTRONICS EQUIP (GRP) CO LTD