The utility model belongs to the LED photoelectric technical field, and specifically relates to an LED structure comprising a first substrate and a second substrate, the first substrate is internally provided with a bowl cup, the second substrate is provided with a positive
electrode pad and a negative
electrode pad which are connected with the bottom surface of the bowl cup, and the positive
electrode pad or the negative electrode pad is provided with a
die bonding area at a position in the bowl cup. A
wafer and an electric lead used for conducting an electrode on the surface of the
wafer with the positive electrode bonding pad or the negative electrode bonding pad are arranged on the
wafer fixing area, the periphery of the wafer and the periphery of the electric lead are wrapped with packaging
colloid, and heat conduction columns are further arranged at the positions, corresponding to the positive electrode bonding pad, the negative electrode bonding pad and the wafer fixing area, in the second substrate respectively. According to the utility model, an
electroplating or
sputtering coating design process adopted by a traditional support is broken through, compared with an integrated support mold opening
electroplating, the manufacturing cost of design and development is lower, the flexibility of design and development is higher, and the support has the advantages of better product practicability, better compatibility, better effect and performance and the like.