Method of manufacturing semiconductor devices and corresponding semiconductor device

A semiconductor and device technology, applied in the field of manufacturing semiconductor devices and corresponding semiconductor devices, can solve problems such as expensive assembly and complexity, and achieve the effect of cost reduction

Pending Publication Date: 2020-06-30
STMICROELECTRONICS SRL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0011] General clips have been proposed, but they are very expensive and complicated to assemble
[0012] Also, attaching the clip via soft solder may result in an essentially "dirty" process that may require additional cleaning steps

Method used

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  • Method of manufacturing semiconductor devices and corresponding semiconductor device
  • Method of manufacturing semiconductor devices and corresponding semiconductor device
  • Method of manufacturing semiconductor devices and corresponding semiconductor device

Examples

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Embodiment Construction

[0027] In the following description, one or more specific details are set forth in order to provide an in-depth understanding of examples of embodiments of the specification. Embodiments may be presented without one or more of the specific details, or with other methods, components, materials, etc. In other instances, known structures, materials, or operations may not be shown or described in detail so as not to obscure aspects of the embodiments.

[0028] References to "an embodiment" or "one embodiment" in this specification are intended to indicate that a specific configuration, structure, or characteristic described in relation to the embodiment is included in at least one embodiment. Thus, phrases such as "in an embodiment" or "in one embodiment," which may appear in one or more places in this specification, do not necessarily refer to one and the same embodiment. In addition, particular configurations, structures, or characteristics may be combined in any suitable manne...

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PUM

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Abstract

The invention relates to a method of manufacturing semiconductor devices and corresponding semiconductor devices. A semiconductor chip is mounted on a leadframe. A first portion of an insulating package for the semiconductor chip is formed from laser direct structuring (LDS) material molded onto the semiconductor chip. A conductive formation (provided by laser-drilling the LDS material and plating) extends between the outer surface of the first portion of insulating package and the semiconductor chip. An electrically conductive clip is applied onto the outer surface of the first portion of theinsulating package, with the electrically conductive clip electrically coupled to the conductive formation and the leadframe. A second portion of the insulating package is made from package molding material (epoxy compound) molded onto the electrically conductive clip and applied onto the outer surface of the first portion of the insulating package.

Description

[0001] Cross References to Related Applications [0002] This application claims the benefit of priority from Italian Patent Application Serial No. 102018000020998 filed on December 24, 2018, the contents of which are hereby incorporated by reference in their entirety to the fullest extent permitted by law. technical field [0003] This specification relates to the manufacture of semiconductor devices such as integrated circuits (ICs). [0004] One or more embodiments may be applied to a semiconductor package, for example, a QFN (Quad Flat No-lead) type semiconductor package. [0005] Power ICs for use in the automotive, industrial and consumer fields (eg so-called "smart" power ICs) using QFN packaging are exemplary possible fields of application of embodiments. Background technique [0006] For example, power QFN circuits may use clips attached with soft solder. [0007] Clips, such as copper clips, can be employed in place of conventional wire bond interconnects with t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/48H01L23/495
CPCH01L21/4825H01L23/49548H01L23/3135H01L24/24H01L24/48H01L24/49H01L24/73H01L24/82H01L24/92H01L24/97H01L2224/04105H01L2224/32245H01L2224/40245H01L2224/45014H01L2224/48137H01L2224/48247H01L2224/4903H01L2224/49051H01L2224/73227H01L2224/73265H01L2224/73267H01L2224/82039H01L2224/92164H01L2224/92244H01L2224/92247H01L2224/97H01L2924/14H01L23/49575H01L23/49524H01L21/4853H01L21/561H01L23/3107H01L2224/82103H01L2224/73221H01L2224/85H01L2224/82H01L2924/00012H01L2924/00H01L21/76894H01L23/49816H01L23/49861H01L24/13H01L2021/60112H01L2224/13
Inventor F·G·齐格利奥利
Owner STMICROELECTRONICS SRL
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