Quartz wafer for quartz crystal resonator or oscillator

Abstract

The invention discloses a quartz wafer for a quartz crystal resonator or oscillator, at least one through hole is formed in the position, corresponding to a dispensing point, of the quartz wafer, andafter a main electrode and an auxiliary electrode are machined on the quartz wafer, the through hole is located in the position of the auxiliary electrode. Thus, the quartz wafer of the present invention is provided. The wafer through hole is placed on a first dispensing point and a second dispensing point, and the colloid can extend from the lower surface of a resonance member to the upper surface of the resonance member through the through hole. According to the technical scheme of the invention, the glue columns are formed on the resonance member, and the solidified glue columns fix the resonance member like rivets, so that a stronger fixing force can be provided, the firmness degree of four glue points in the prior art can be obtained only by two glue points, and even the firmness effect superior to that of the four glue points in the prior art can be obtained.

Description

Technical field [0001] The invention relates to the field of electronic components, and in particular to a quartz wafer used for a quartz crystal resonator or oscillator. Background technique [0002] Both the quartz crystal resonator and the quartz crystal oscillator include a base and a quartz resonator plate. The quartz resonator plate is formed of a quartz wafer after cleaning and electrode plating. In the prior art, most of the quartz wafers used to make the resonator plate can be regarded as complete. Cuboid structure, in order to fix the quartz resonator in the base of the oscillator or the resonator, it is necessary to dispense glue on the dispensing platform in the resonator or the base of the oscillator, and then place one end of the quartz resonator on the glue spot, relying on The adhesion of the glue dots is fixed. In order to ensure that the chip is firmly fixed, the prior art generally uses a four-point glue method, such as figure 1 As shown, first, two glue dots,...

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Problems solved by technology

[0003] However, in the four-point dispensing method, all the glue points must be finished, and the colloid can only be cured after the first glue point, the second glue point, the third glue point, and the fourth glue point are fused together. When the quartz resonator is placed on the first glue point and the second glue point, and the first glue point and the second glue point are in a colloidal state, the position of the quartz resonator is very unstable. If a contact dispensing method such as needle point dispensing is used for the third glue point and the fourth glue point, a slight deviation in the angle of the glue dispensing needle will cause the position of the quartz resonator to shift, resulting in a finished product. If the non-contact dispensing method such as spray valve dispensing is used, the minimum size of the spray valve spray point that can be achieved in the industry is about 0.3mm, so it is only suitable for resonators or oscillators with specifications above 2016 For the production of resonators, for small-sized resonators or oscillators similar to the 2016 specification, the smallest glue point that the spray valve can achieve has seriously affected the working characteristics of the quartz resonator.

[0004] In order to avoid the influence of the third glue point and the fourth glue point on the working characteristics of the quartz resonator, some companies have given up the four-point glue point method and completely rely on the two glue points on the glue dispensing platform, namely the first glue point and the second glue point. The adhesive force is used to fix the resonant plate. Obviously, this abandons the fixing force brought by the glue dots above the resonant plate. The actual production has also verified that the firmness of this fixing method is not enough. The chip is easy to fall off or fall off under impact such as falling. Poor contact, resulting in very limited impact resistance of the product

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