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Heat dissipation assembly

A technology for heat dissipation components and valves, which is applied in digital data processing components, instruments, electrical digital data processing, etc., can solve the problems of affecting the heat dissipation efficiency of heat dissipation components, large flow resistance, and different widths of flow channels, so as to reduce fluid pressure. , Improve heat dissipation efficiency, accelerate the effect of fluid circulation

Pending Publication Date: 2020-07-03
GIGA BYTE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Existing water-cooled heat dissipation components are usually limited by the space of the heat source, so there are often situations where the width of the flow channel is different. When the liquid flows from a wider flow channel to a narrower flow channel, a large flow resistance will occur. problems, which in turn affect the heat dissipation efficiency of heat dissipation components

Method used

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  • Heat dissipation assembly
  • Heat dissipation assembly
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Embodiment Construction

[0051] figure 1 It is a three-dimensional appearance schematic diagram of a heat dissipation assembly according to an embodiment of the present invention. Please refer to figure 1 The heat dissipation assembly 100 is suitable for dissipating heat from a heat source (not shown), and the heat source may be, for example, a central processing unit (CPU), a memory, a south bridge chip, a north bridge chip, or a graphics chip on a computer motherboard. In this embodiment, the heat dissipation assembly 100 has a housing 110 and a partition structure 120 disposed in the housing 110 . The housing 110 has an upper shell 111 and a lower shell 113 , and a chamber 112 is formed between the upper shell 111 and the lower shell 113 . The upper shell 111 includes a first water hole 114 and a second water hole 116 . heat sink assembly 100 in figure 1 In the figure, in order to clearly show the internal structure of the casing 110, the upper casing 111 is represented by a dotted line.

[00...

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Abstract

A heat dissipation assembly comprises a shell and a separation structure. The shell is provided with a cavity. The partition structure comprises a partition wall vertically arranged in the cavity so as to divide a first flow channel and a second flow channel in the shell, the partition wall is provided with a crevasse and a valve structure arranged in the crevasse, and when the valve structure isnot pushed open, the valve structure shields the crevasse. When the fluid pressure of one section, beside the valve structure, of the first flow channel and the second flow channel is larger than thefluid pressure of the other section, beside the valve structure, of the first flow channel and the second flow channel, the valve structure is pushed away, and at least part of the crevasse is exposed.

Description

technical field [0001] The invention relates to a heat dissipation component, in particular to a heat dissipation component utilizing liquid for heat conduction. Background technique [0002] Today's computer gamers focus on good computer performance, and high-performance computer components require higher power consumption. The operating temperature of high-power computer components increases in high-speed calculation environments, which affects the smoothness of computer systems. Water-cooled heat dissipation components are one of the common heat dissipation methods at present. It mainly absorbs heat energy from a heat source (such as a motherboard, a central processing unit (CPU) or a display chip) through a liquid, and then discharges the heat-absorbed liquid for heat exchange and cooling. And heat dissipation in this cycle. [0003] In addition, the temperature of a heat source (such as a motherboard, a central processing unit, or a display chip) is generally affected...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G06F1/20
CPCG06F1/20G06F2200/201
Inventor 黄顺治毛黛娟林宜臻
Owner GIGA BYTE TECH CO LTD
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