Semiconductor substrate cleaning method and adjusting method

Abstract

The invention provides a semiconductor substrate cleaning method and an adjusting method. The method for cleaning a semiconductor substrate comprises the following steps: acquiring an interval angle between an identification notch and a pollution area, then vertically placing a semiconductor substrate in a cleaning tank, and defining the position of the identification notch in the cleaning tank through the interval angle, so that the pollution area is located in a direction from ten o'clock to one o'clock in the cleaning tank; executing a cleaning process to remove pollutants in the polluted area. The semiconductor substrate adjusting method comprises the following steps: executing a first process on a semiconductor substrate, and then obtaining a second process to be executed by the semiconductor substrate; and judging whether the second process to be executed by the semiconductor substrate is a cleaning process or not, and if so, the identification notch of the semiconductor substrate being positioned in the direction from eight o'clock to ten o'clock. Therefore, the problem that the position of the semiconductor substrate does not accord with the process or affects the process is avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductor manufacturing, in particular to a semiconductor substrate cleaning method and adjustment method. Background technique [0002] In the production process of semiconductor devices, there is an inevitable contact between the semiconductor substrate and the process machine parts and the transfer box for loading the semiconductor substrate, so the semiconductor substrate will be polluted, and the semiconductor substrate needs to be cleaned. Cleaning is performed to remove contaminants from the semiconductor substrate. However, in the existing cleaning process, after the semiconductor substrate is cleaned, a large amount of pollutants still remain on the surface of the semiconductor substrate, which will affect the yield of products. Furthermore, the semiconductor substrate needs to be cleaned multiple times to completely remove the pollutants on the surface of the semiconductor substrate, so as ...

AI Technical Summary

Problems solved by technology

Moreover, the semiconductor substrate needs to be subjected to multiple ion implantation processes. After completing multiple ion implantation processes, the position of the semiconductor substrate needs to be adjusted and cleaned. Therefore, after completing one or multiple ion implantation processes After that, it is impossible to determine whether to adjust the position of the semiconductor substrate, thus a method is needed to determine whether the position of the semiconductor substrate is adjusted

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