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A kind of welding method of micro LED chip, display panel and Micro LED chip

A display panel and chip technology, applied in welding equipment, laser welding equipment, manufacturing tools, etc., can solve problems such as component damage and achieve the effect of avoiding damage

Active Publication Date: 2021-06-01
CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, direct heating of the display panel may cause damage to the components on the display panel
With the current LED structure, Micro LED can only be soldered to the display panel by directly heating the display panel.

Method used

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  • A kind of welding method of micro LED chip, display panel and Micro LED chip
  • A kind of welding method of micro LED chip, display panel and Micro LED chip
  • A kind of welding method of micro LED chip, display panel and Micro LED chip

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Experimental program
Comparison scheme
Effect test

Embodiment approach

[0044] 1. Neither the first passage nor the second passage is provided with a conductive material (that is, the conductive material is air).

[0045]2. The first passage or the second passage is provided with a conductive material, that is, no conductive material is provided in the first passage (that is, the conductive material is air), and a conductive material is provided in the second passage; or A conduction material is provided in one passage, and no conduction material is provided in the second passage (that is, the conduction material is air).

[0046] 3. The first via and the second via are provided with the same conductive material.

[0047] 4. The first via is provided with a first conduction material, the second via is provided with a second conduction material, and the first conduction material is different from the second conduction material.

[0048] By setting the conduction material in the passage, the above-mentioned conduction material has good light transm...

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PUM

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Abstract

The present application relates to a welding method for a Micro LED chip, a display panel and a Micro LED chip. The Micro LED chip includes: an N-type semiconductor layer, a P-type semiconductor layer, an N-type electrode and a P-type electrode, wherein the N-type The electrode is arranged on the N-type semiconductor layer, and the P-type electrode is arranged on the P-type semiconductor layer; the N-type electrode includes a first path, and the first path runs through the N-type electrode; the P-type electrode includes A second via, the second via passing through the P-type electrode. Through the Micro LED chip with the first via and the second via in this application, other methods can be used to solder the Micro LED to the display panel, for example, a laser beam can be used to pass through the first via and the second via to melt the solder, and the solder After condensation, the Micro LED chip and the display panel are connected together to avoid damage to the components on the display panel caused by direct heating of the display panel during the welding process.

Description

technical field [0001] The present application relates to the technical field of Micro LED, in particular to a method for welding Micro LED chips, display panels and Micro LED chips. Background technique [0002] Micro LED is a new generation of display technology, which has higher brightness and better luminous efficiency than the existing OLED technology, but lower power consumption. The display made of Micro LED has the advantages of good stability, longer service life, and lower operating temperature. It also inherits the low power consumption, high color saturation, fast response, and strong contrast of existing LEDs. advantages and great application prospects. [0003] At present, in the process of manufacturing the Micro LED display, it is necessary to weld the two electrodes of the Micro LED to the display panel, so that the two electrodes of the Micro LED have good electrical contact with the corresponding electrical contact points on the display panel. Such as f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/38H01L25/075H01L33/62B23K26/21
CPCH01L33/38H01L33/382H01L25/0753H01L33/62B23K26/21B23K2101/36H01L2933/0066H01L24/14H01L24/05H01L24/16H01L24/81H01L33/32H01L33/42H01L2224/05551H01L2224/05578H01L2224/16057H01L2224/16225H01L2224/81201H01L2224/81224H01L2224/81815
Inventor 陈靖中
Owner CHONGQING KONKA PHOTOELECTRIC TECH RES INST CO LTD