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Electric power conversion device

A technology for power conversion devices and power terminals, which is applied to circuits, electrical components, and electrical solid devices, to achieve cooling performance and productivity improvements, reduce manufacturing man-hours, and improve productivity

Active Publication Date: 2020-07-03
DENSO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, there is also a problem from the viewpoint of productivity

Method used

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Examples

Experimental program
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Embodiment approach 1

[0059] refer to Figure 1 to Figure 12 Embodiments of the power conversion device will be described.

[0060] Such as figure 1 As shown, the power conversion device 1 of the present embodiment has a semiconductor element 2 , a plurality of lead frames 3 , a cooling pipe 4 , an insulating portion 5 , a metal bonding material 6 , and a resin sealing portion 7 .

[0061] The lead frame 3 is electrically connected to the semiconductor element 2 . The cooling pipe 4 is one form of a channel forming body in which a refrigerant channel 41 through which the refrigerant flows is formed. The insulating part 5 is arranged between the lead frame 3 and the cooling pipe 4 to insulate them. Metal joint material 6 joins insulating portion 5 and cooling pipe 4 . The resin sealing portion 7 seals the semiconductor element 2 and the lead frame 3 .

[0062] The resin sealing portion 7 integrates the semiconductor element 2 and the lead frame 3 with the cooling pipe 4 to form a semiconductor ...

Embodiment approach 2

[0098] In the power conversion device 1 of the present embodiment, if Figure 13 As shown, the semiconductor cooling unit 10 has a plurality of semiconductor components 2 . That is, one semiconductor cooling module 10 has a plurality of semiconductor elements 2 arranged side by side in a direction perpendicular to the stacking direction X between a pair of cooling pipes 4 . also, Figure 13 is a cross-sectional view of the semiconductor cooling module 10 on a plane perpendicular to the longitudinal direction Z.

[0099] In this embodiment, a plurality of semiconductor elements 2 are arranged side by side in the lateral direction Y.

[0100] In addition, at least two of the plurality of semiconductor elements 2 in the semiconductor cooling unit 10 are an upper arm semiconductor element 2u and a lower arm semiconductor element 2d connected in series to each other. In addition, in this embodiment, the number of semiconductor elements 2 built in the semiconductor cooling unit 1...

Embodiment approach 3

[0117] Such as Figure 18 ~ Figure 20 As shown, the power conversion device 1 of the present embodiment has a configuration in which the insulating portion 5 is arranged over the two laminated component groups 11 .

[0118] That is, if Figure 18 As shown, two laminated component groups 11 share two insulating portions 5 . One insulating portion 5 is bonded to an opposing surface 43 of one cooling pipe 4 via a metal bonding material 6 . In addition, one insulating portion 5 is bonded to the opposing surface 43 of the other cooling pipe 4 via the metal bonding material 6 . Further, two semiconductor elements 2 are arranged side by side together with the lead frame 3 and the terminal chip 12 between the pair of insulating portions 5 arranged to face each other in the stacking direction X. As shown in FIG.

[0119] In addition, in this embodiment, if Figure 18 , Figure 19 As shown, on one main surface of the insulating portion 5, two metal layers 52 are formed at two posit...

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PUM

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Abstract

An electric power conversion device (1) comprises: a semiconductor element (2); a plurality of lead frames (3) which are electrically connected to the semiconductor element (2); a flow path forming body (4) that forms a coolant flow path (41) in which a coolant flows; an insulation part (5) which is arranged between the lead frames (3) and the flow path forming body (4) so as to insulate the leadframes (3) and the flow path forming body (4) from each other; a metal bonding material (6) which bonds the insulation part (5) and the flow path forming body with each other; and a resin sealing part(7) which seals the semiconductor element (2) and the lead frames (3). The resin sealing part (7) integrates the semiconductor element (2) and the lead frames (3) with the flow path forming body (4),thereby forming a semiconductor cooling assembly (10).

Description

[0001] Cross References to Related Applications [0002] This application claims priority from Japanese Application No. 2017-156255 filed on August 11, 2017, the entire contents of which are hereby incorporated by reference. technical field [0003] The present invention relates to power conversion devices. Background technique [0004] As a structure for efficiently dissipating heat from semiconductor elements constituting a power conversion device, for example, as disclosed in Patent Document 1, there is a structure using a cooling pipe provided with a refrigerant flow path inside. In this cooling structure, grease is interposed between the semiconductor module incorporating the semiconductor element and the cooling pipe. That is, the semiconductor module and the cooling pipe, which are mutually different components, are brought into contact with grease interposed therebetween. As a result, cooling performance can be improved by reducing the thermal resistance between th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H02M7/48H01L23/36H01L25/07H01L25/18H05K7/20
CPCH02M7/48H05K7/20H01L25/117H01L25/072H01L25/50H01L23/473H01L23/4334H01L23/3735H01L23/49575H01L23/49562H01L23/4012H01L23/051H01L23/3121H01L2224/33181H01L2224/32245H01L24/32H01L24/29H01L24/33H01L2224/29147H01L2224/83191H01L2924/1815H01L2224/2612H01L2224/40245H01L2224/291H01L2924/00014H01L2924/014H01L23/46H01L23/49537H01L23/49568H01L21/4871H01L23/3107H01L23/36
Inventor 松沢大树巴赫曼·苏丹尼侯赛尼
Owner DENSO CORP
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