Cleaning device and injection-molding stamping equipment with same

Abstract

The invention discloses a cleaning device and injection-molding stamping equipment with the cleaning device. The cleaning device comprises a robot connecting head and a cleaning component, wherein therobot connecting head is connected with one end of the cleaning component, and a docking slot for being connected with a robot is formed in the robot connecting head. The cleaning component comprisesa shell, a driving unit and a cleaning piece. The shell is connected with the robot connecting head. The driving unit is arranged in the shell. The cleaning piece is connected with the driving unit and is located on the side, deviating from the robot connecting head, of the shell. The cleaning device has the beneficial effects of being simple and compact in structure, facilitating automatic cleaning, convenient to adjust, good in compatibility, long in service life and good in cleaning effect.

Description

technical field [0001] The invention relates to the technical field of injection molding, in particular to a cleaning device and injection molding stamping equipment with the cleaning device. Background technique [0002] A semiconductor device is an electronic device whose conductivity is between a good conductor and an insulator. It uses the special electrical properties of semiconductor materials to complete specific functions. It can be used to generate, control, receive, transform, amplify signals and perform energy conversion. [0003] With the development of technology, the miniaturization and multi-function of electronic products have become the main development direction. The miniaturization of electronic products requires semiconductor devices not only to be smaller in size, but also to ensure their structural strength and anti-pollution and anti-corrosion performance. Therefore, injection molding packaging is required. Semiconductor devices are packaged in the mos...

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Problems solved by technology

[0003] With the development of technology, the miniaturization and multi-function of electronic products have become the main development direction. The miniaturization of electronic products requires semiconductor devices not only to be smaller in size, but also to ensure their structural strength and anti-pollution and anti-corrosion performance. Therefore, injection molding packaging is required. Semiconductor devices are packaged in the most advanced way, and it is necessary to ensure that the injection mold before packaging is clean and free of impurities; however, in the prior art, the injection mold still needs to be cleaned manually with a brush, and the production efficiency is low, which greatly restricts the development of smart devices. , providing a cleaning device with a simple and compact structure that is convenient for automatic cleaning has become a problem that must be solved at present

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