Unlock instant, AI-driven research and patent intelligence for your innovation.

A system having light source with extended spectrum for semiconductor chip surface topography metrology

A semiconductor and light source technology, applied in the field of metering systems, can solve problems such as wafer edge mold opening, degradation rate, interface morphology defects, etc.

Active Publication Date: 2020-07-07
YANGTZE MEMORY TECH CO LTD
View PDF6 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, interface topography defects can cause die opening issues at the wafer edge during the bonding process, resulting in severe yield loss or degradation

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • A system having light source with extended spectrum for semiconductor chip surface topography metrology
  • A system having light source with extended spectrum for semiconductor chip surface topography metrology
  • A system having light source with extended spectrum for semiconductor chip surface topography metrology

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0039] While specific configurations and arrangements are discussed, it should be understood that this is done for illustrative purposes only. A person skilled in the relevant art will recognize that other configurations and arrangements may be used without departing from the spirit and scope of the present disclosure. It will be apparent to those skilled in the relevant art that the present disclosure may also be used in a variety of other applications.

[0040] It should be noted that references in the specification to "one embodiment," "an embodiment," "exemplary embodiment," "some embodiments," etc., indicate that the described embodiments may include particular features, structures, or characteristics, but each embodiment may not necessarily include that particular feature, structure or characteristic. Furthermore, such phrases are not necessarily referring to the same embodiment. In addition, when a particular feature, structure or characteristic is described in conjun...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Widthaaaaaaaaaa
Widthaaaaaaaaaa
Login to View More

Abstract

Embodiments of a system for classifying interference signals are disclosed. In one example, the system for classifying the interference signals includes an interferometer including a light source anda detector, and at least one processor. The interferometer is configured to provide a plurality of interference signals, each interference signal corresponding to a respective one of a plurality of locations on a surface of the semiconductor chip. The spectrum of the light source is greater than the spectrum of the white light. The at least one processor is configured to classify the interferencesignal into a plurality of categories using a model. Each of these categories corresponds to a region of the same material on the surface of the semiconductor chip.

Description

technical field [0001] Embodiments of the present disclosure relate to metrology systems and methods in semiconductor manufacturing. Background technique [0002] Surface topography is an important surface property, and it affects the performance of semiconductor products and their manufacturing processes. For example, wafer bonding processes have been increasingly used in semiconductor devices to achieve innovative stacked structures. The topography that defines the flatness of the wafer surface is one of the most critical factors for achieving good bonding results. A successful bonding process requires ultra-precise alignment of the two wafers, as well as planarization of the bonding interface. For example, interface topography defects can cause die opening problems at the wafer edge during the bonding process, resulting in severe yield loss or degradation. Contents of the invention [0003] Embodiments of a system for classifying interference signals are disclosed he...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): G01B11/24
CPCG01B11/2441G01B9/02029G01B9/02057G01B9/02072G01B9/02075G01B9/02083G01B9/02084G01B9/0209G01B11/0608G01B2210/56G01N21/95684G01B9/02044G01B9/02074G01B11/306G01N21/9501H01L21/67288
Inventor 王思聪丁小叶
Owner YANGTZE MEMORY TECH CO LTD