Array substrate, display equipment and preparation process of array substrate
An array substrate and a manufacturing process technology, applied in the field of display modules and their manufacturing processes, can solve the problems of signal crosstalk, overlapping area expansion, evaporation area offset and the like
Pending Publication Date: 2020-07-10
BOE TECH GRP CO LTD +1
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Problems solved by technology
Due to the limited equipment process capability of existing array substrates, there will inevitably be overlapping areas in the evaporation areas of B, G, and R three-color pixel light-emitting materials, and it is easier to shift the evaporation areas due to equipment process fluctuations, thus making The overlapping area is further expanded
Therefore, during the electrification process of the existing array substrate, the holes will diffuse to adjacent pixels through the overlapping area, resulting in adverse events such as signal crosstalk.
Method used
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[0060] Typical embodiments embodying the features and advantages of the present invention will be described in detail in the following description. It should be understood that the present invention can have various changes in different embodiments without departing from the scope of the present invention, and that the description and drawings therein are illustrative in nature and not intended to limit the present invention. invention.
[0061]In the following description of various exemplary embodiments of the invention, reference is made to the accompanying drawings, which form a part hereof, and in which are shown by way of example different exemplary structures, systems, and embodiments in which aspects of the invention may be implemented and steps. It is to be understood that other specific arrangements of components, structures, exemplary devices, systems and steps may be utilized and structural and functional modifications may be made without departing from the scope ...
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The invention provides an array substrate, display equipment and a preparation process of the array substrate. The array substrate comprises a pixel definition layer and a pixel light-emitting material layer, wherein the pixel light-emitting material layer comprises a B pixel light-emitting material layer, a G pixel light-emitting material layer and an R pixel light-emitting material layer, the Bpixel light-emitting material layer and the G pixel light-emitting material layer are partially overlapped at the top of the pixel definition layer, and the G pixel light-emitting material layer and the R pixel light-emitting material layer are partially overlapped at the top of the pixel definition layer. The array substrate further comprises a hole blocking layer. And the hole blocking layer isarranged between the overlapped parts of the B pixel luminescent material layer and the G pixel luminescent material layer, and is also arranged between the overlapped parts of the G pixel luminescentmaterial layer and the R pixel luminescent material layer.
Description
technical field [0001] The invention relates to the technical field of a display module and its preparation process, in particular to an array substrate, a display device and a preparation process of the array substrate. Background technique [0002] The existing array substrate mainly includes an anode 110, a pixel definition layer 120, a hole transport layer and a hole injection layer 130, and a pixel luminescent material layer 140 (including a B pixel luminescent material layer 141, a G pixel luminescent material layer 142, and an R pixel luminescent material layer 140). Layer 143), electron transport layer and electron injection layer 150, cathode 160, for details, please refer to figure 1 A schematic structural diagram of an array substrate is shown. Due to the limited equipment process capability of existing array substrates, there will inevitably be overlapping areas in the evaporation areas of B, G, and R three-color pixel light-emitting materials, and it is easier ...
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Login to View More IPC IPC(8): H01L27/32H01L51/56
CPCH10K59/353H10K59/35H10K71/00
Inventor 刘宇熙黄鸿麻清琳赵洋王畅
Owner BOE TECH GRP CO LTD