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Efficient preparation device of optoelectronic assembly

A preparation device and optoelectronic technology, applied in positioning devices, grinding drive devices, grinding/polishing equipment, etc., can solve the problems of low processing efficiency and achieve the effect of efficient coverage

Active Publication Date: 2020-07-14
HARBIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When processing optoelectronic components, the parts covered have asymmetric structures. When the existing equipment clamps them, they need to be placed at precise positions, and then manually clamped and fixed, and the processing efficiency is relatively high. Low

Method used

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  • Efficient preparation device of optoelectronic assembly
  • Efficient preparation device of optoelectronic assembly
  • Efficient preparation device of optoelectronic assembly

Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 1

[0028] Such as Figure 1-7 As shown, a high-efficiency preparation device for optoelectronic components includes an electric telescopic rod I101, a beam 2, a slideway I201, an electric telescopic rod III210, a mechanical arm 3, a sliding seat 301 and an arm main body 302. The left and right ends of the beam 2 are The electric telescopic rod I101 is installed for lifting. The lower end of the beam 2 is provided with a slideway I201. The mechanical arm 3 includes a sliding seat 301 and an arm main body 302. The lower end of the sliding seat 301 is fixed to the arm main body 302. Two sliding seats 301 are slidingly connected in the slideway I201, the two sides of the upper end of the crossbeam 2 are connected with the slideway I201, the upper ends of the two sliding seats 301 pass through the crossbeam 2, and the two sliding seats 301 are respectively fixed on the The two ends of the electric telescopic rod I101. When the two mechanical arms 3 are close to each other, they are u...

specific Embodiment approach 2

[0030] Such as Figure 1-7 As shown, the mechanical arm 3 also includes a motor I303, a screw I304, a round steel 305 and a handle 306, the output shaft of the motor I303 is fixedly connected to the upper end of the screw I304, and the motor I303 is fixedly connected to the sliding seat 301 The lower end of the lead screw I 304 is rotatably connected to the lower end of the arm main body 302, the upper and lower ends of the round steel 305 are fixedly connected to the sliding seat 301 and the arm main body 302 respectively, the supporting handle 306 is threadedly connected with the leading screw I 304, and the supporting handle 306 is connected slidingly On round steel 305. Start the motor I 303, the motor I 303 drives the lead screw I 304 to rotate, the lead screw I 304 can drive the supporting handle 306 to lift, and the supporting handle 306 can touch the edge of the bottom of the housing to increase the stability of the asymmetrical objects.

specific Embodiment approach 3

[0032] Such as Figure 1-7 As shown, the high-efficiency preparation device for optoelectronic components also includes a preparation table 1 and a dark groove 102. The lower ends of the two electric telescopic rods I 101 are fixedly connected to the preparation table 1. The upper end of the preparation table 1 is provided with a dark groove 102 and a handle 306. It can be located in the dark groove 102 and not protrude out of the dark groove 102 . Lower the supporting handles 306 into the dark groove 102, place the casing directly on the preparation table 1, when the two mechanical arms 3 are close to clamping the casing, the two supporting handles 306 also automatically extend into the lower end of the casing, Then, the shell can be "hugged" stably.

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PUM

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Abstract

The invention relates to the field of optoelectronic assemblies, in particular to an efficient preparation device for an optoelectronic assembly. According to the efficient preparation device, two mechanical arms can automatically hold the optoelectronic assembly or independent parts of the optoelectronic assembly placed below a cross beam, the distance between the mechanical arms and a to-be-clamped shell does not need to be calculated, the shell does not need to be accurately placed to a certain accurate position, and other auxiliary electronic components do not need to be detected; parts ofthe whole fixed shell can integrally slide left and right on the cross beam, so that the parts can be conveniently moved out to enable an operator to carry out other operations on a preparation tableor prepare for processing the shell, and the shell is aside to wait for the next step of processing; when the shell which does not need to be fixed slides left and right on the cross beam along withthe parts of the whole fixed shell, a cushioned seat and a cushioned shell can be locked; and the shell can move left and right or up and down through the arm main body, and the shell can be efficiently machined with a wide coverage surface by combining with a high-degree-of-freedom polishing head.

Description

technical field [0001] The invention relates to the field of optoelectronic components, in particular to a high-efficiency preparation device for optoelectronic components. Background technique [0002] Optoelectronic components have a wide range of applications, such as home cameras, mobile phone cameras, night vision glasses, low-light cameras, photoelectric sights, infrared detection, infrared guidance, infrared remote sensing, fingerprint detection, missile detection, medical detection and perspective, etc., from military Products are extended to civilian products, and the scope of use is innumerable, which is a huge industry. When processing optoelectronic components, the parts covered have asymmetric structures. When the existing equipment clamps them, they need to be placed at precise positions, and then manually clamped and fixed, and the processing efficiency is relatively high. Low. Contents of the invention [0003] The purpose of the present invention is to p...

Claims

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Application Information

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IPC IPC(8): B24B29/02B24B41/06B24B41/02B24B47/04B24B47/22B23B41/00B23Q3/06
CPCB23B41/00B23Q3/062B24B29/02B24B41/02B24B41/06B24B47/04B24B47/22
Inventor 王娜娜
Owner HARBIN UNIV