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Novel LED packaging method

A technology of LED packaging and LED chips, applied in electrical components, electrical solid devices, circuits, etc., can solve problems such as cross excitation of phosphors, and achieve the effect of improving visual performance and material light energy conversion efficiency

Inactive Publication Date: 2020-07-14
GUANGZHOU LEDTEEN OPTOELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] In order to overcome the deficiencies of the prior art, the object of the present invention is to provide a new LED packaging method, which solves the technical problem of cross-excitation between phosphors, effectively improves the maximum visual performance of the product and the light energy conversion efficiency of the material, and makes the phosphors Conformity improves light color uniformity and facilitates production

Method used

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Examples

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Embodiment 1

[0040] A new LED packaging method, such as figure 1 shown, including the following steps:

[0041] 1) Brush the release agent on the mold: use the release agent to evenly brush the edge of the mold hole and the contact surface with the substrate 1;

[0042] 2) The mold is fixed on the substrate 1: fix the mold that has been brushed with release agent according to the positioning hole of the substrate;

[0043] 3) Preparation of red phosphor glue 2: Evenly mix the proportioned silica gel and red phosphor, and vacuum stir to defoam after mixing. The mixing ratio of silica gel and red phosphor is 0.7:0.3; the wavelength of red phosphor is 619nm; the viscosity of silica gel is 26000mPas;

[0044] 4) Brushing the red phosphor glue 2: brush the red phosphor glue 2 obtained in step 3) into the mold hole in step 2) evenly;

[0045] 5) Red phosphor glue 2 is baked and cured: put the product that has completed step 4) into an oven at 150°C and bake for 1 hour to cure the red phosphor...

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Abstract

The invention discloses a novel LED packaging method, and red fluorescent powder glue and yellow-green fluorescent powder glue are selected to be packaged on an LED chip, and a final finished productcan excite red light and yellow-green light, thereby solving the technical problem of cross excitation between fluorescent powder, and effectively improving the maximum visual efficiency of the product and the light energy conversion efficiency of a material. By respectively controlling the silica gel viscosity of the red fluorescent powder glue and the yellow-green fluorescent powder glue, the fluorescent powder glue is not easy to shift, so the light color uniformity is improved, and the production is convenient.

Description

technical field [0001] The invention relates to the technical field of LEDs, in particular to a novel LED packaging method. Background technique [0002] LED has the advantages of high brightness, low heat, long life, environmental protection, renewable utilization, etc., and is called the most promising new generation of green lighting source in the 21st century. [0003] In the traditional LED phosphor packaging, after the LED chip is fixed on the bracket or the substrate, the LED chip and the substrate are connected to form a line with a bonding wire, and then the protection area or point is formed along the periphery of the chip with the dam glue. In the glue area, a certain proportion of LED phosphor powder and silica gel is evenly mixed and sealed on the LED chip, and then baked and cured or baked and cured after the phosphor powder settles. The common dispensing methods include dispensing or spraying , in order to realize that after the LED chip is electrified, the f...

Claims

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Application Information

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IPC IPC(8): H01L25/075H01L33/48H01L33/50
CPCH01L25/0753H01L33/486H01L33/504H01L33/508H01L2933/0033H01L2933/0041
Inventor 李明珠夏雪松
Owner GUANGZHOU LEDTEEN OPTOELECTRONICS CO LTD
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