Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Photosensitive chip packaging part and manufacturing method thereof

A technology for photosensitive chips and manufacturing methods, which is applied in the manufacture of electrical components, semiconductor devices, and final products, and can solve problems such as the inability to realize photosensitive characteristics of chips, improve stability and production efficiency, realize photosensitive characteristics, and reduce process difficulty. Effect

Pending Publication Date: 2020-07-14
CHANGJIANG ELECTRONICS TECH CHUZHOU
View PDF1 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] The purpose of the present invention is to overcome the disadvantages in the prior art that when making photosensitive chip packages, the black plastic sealant will stain the transparent glue during the packaging process, resulting in the inability to realize the photosensitive characteristics of the chip. A photosensitive chip package of the present invention The components and their manufacturing methods can prevent the transparent glue from being stained, and can further realize the photosensitive characteristics of the chip

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Photosensitive chip packaging part and manufacturing method thereof
  • Photosensitive chip packaging part and manufacturing method thereof
  • Photosensitive chip packaging part and manufacturing method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] combine figure 1 Shown, the manufacture method of a kind of photosensitive chip package of the present invention, the method concrete steps of the present invention are as follows:

[0032] S1. Half-etch the upper part of the substrate to form the upper part of the base island 110 and the upper part of the pins 120 located on both sides or around the base island 110; then process the upper part of the base island 110 to obtain grooves 111 and dams 112 ; Specifically, the upper part of the base island 110 is stamped to form the groove 111 and the dam 112; it is worth noting that the dam 112 is extruded from a ductile metal substrate, specifically, during the stamping process, The metal material on the surface of the base island 110 is extruded to form a groove 111 inside the base island 110, while the metal material extends upward along the inner sidewall of the groove 111 to form a dam 112, and connects the dam 112 to the groove 111 , the groove 111 formed by stamping ...

Embodiment 2

[0046] combine image 3 As shown, the content of this embodiment is basically the same as that of Embodiment 1, except that the chip 200 of this embodiment is flip-chip packaged, such as Figure 4 As shown, the chip 200 is electrically connected to the pin 120 through solder balls. In the method for manufacturing a photosensitive chip package of this embodiment, in step S3, solder balls are provided on both sides or around the bottom of the chip 200 in advance, the chip 200 provided with solder balls is placed on the transparent glue 300, and soldered The corresponding balls are electrically connected to the pins 120 , and the photosensitive area of ​​the chip 200 is attached to the transparent adhesive 300 . Subsequently, the liquid transparent glue 300 is heated and cured. The dam 112 on the base island 110 can match the height of the solder balls, thereby raising the height of the transparent glue 300, so that the transparent glue 300 can be attached to the photosensitive...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a photosensitive chip packaging part and a manufacturing method thereof and belongs to the technical field of semiconductor packaging. The photosensitive chip packaging part comprises a base island, pins, a chip, a transparent adhesive and a plastic packaging material; the base island is provided with a groove and a box dam; the transparent adhesive is arranged in the groove and the box dam; the pins are electrically connected with the chip; the plastic package material wraps the upper part of the base island, the upper parts of the pins, electrical connection parts andthe chip. According to the photosensitive chip packaging part and the manufacturing method thereof of the invention, half-etching is performed on the upper part of a base material, so that the upperparts of the base island and the pins are formed; the upper part of the base island is treated, so that the groove and the box dam can be formed; the transparent adhesive is added into the groove andthe box dam, so that the photosensitive area of the chip is attached to the transparent adhesive, and the chip is connected with the pins; the liquid transparent adhesive is cured, and plastic packaging is performed by using the plastic packaging material; and semi-etching is carried out on the lower part of the base material, so that a photosensitive through hole can be formed. The invention aimsto solve the problem of failure to realize the photosensitive characteristic of the chip caused by the fact that the plastic packaging material can stain the transparent adhesive can be solved; the transparent adhesive can be prevented from being stained; and the photosensitive characteristic of the chip can be realized.

Description

technical field [0001] The invention relates to the technical field of semiconductor packaging, and more specifically, to a photosensitive chip package and a manufacturing method thereof. Background technique [0002] Packaging plays an important role in CPU and other LSI integrated circuits. The shell used to install semiconductor integrated circuit chips plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance. It also communicates the internal world of the chip with the external circuit. The bridge - the contacts on the chip are connected to the pins of the package shell with wires, and these pins are connected to other devices through the wires on the printed board. In the prior art, for the packaging of photosensitive chips, most of them use the substrate or the film frame as the carrier, and then cover the photosensitive area with transparent glue to achieve the purpose of photosensitive and protect the photosensitive...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01L31/02H01L31/0203H01L31/18
CPCH01L31/02005H01L31/0203H01L31/18Y02P70/50
Inventor 吴涛岳茜峰吴奇斌吕磊汪阳
Owner CHANGJIANG ELECTRONICS TECH CHUZHOU
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com