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Aluminum substrate foil plate pressing device

A pressing device and aluminum substrate technology, which is applied in the lamination device, lamination, transportation and packaging, etc., can solve problems such as inaccurate lamination, and achieve the effect of improving production efficiency and accuracy

Active Publication Date: 2020-07-28
山西鼎隆智装科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is to provide a laminating device for aluminum substrate and foil plate, which solves the problem of inaccurate lamination between aluminum substrate and copper foil

Method used

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  • Aluminum substrate foil plate pressing device
  • Aluminum substrate foil plate pressing device
  • Aluminum substrate foil plate pressing device

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Embodiment Construction

[0030] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0031] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", The orientation or positional relationship indicated by "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have Certain orientations, constructed and operative in certain orientations, therefore are not t...

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Abstract

The invention relates to the field of aluminum substrate production and processing, in particular to an aluminum substrate foil plate laminating device. The device comprises a positioning table, a feeding assembly used for feeding aluminum substrates, a conveying assembly used for feeding copper foils, a pressing assembly, a discharging conveying belt, and four first photoelectric sensors used forpositioning and pressing the aluminum substrates and the copper foils. The positioning table is arranged between the feeding assembly and the conveying assembly. The feeding direction of the feedingassembly is perpendicular to the feeding direction of the conveying assembly. The pressing assembly is arranged beside the transmission assembly; the four first photoelectric sensors are all arrangedon the pressing assembly. Four second photoelectric sensors corresponding to the first photoelectric sensors are arranged on the positioning table and the transmission assembly; the feeding assembly includes a feeding conveyor belt. According to the aluminum substrate laminating machine, the problem of inaccurate laminating between the aluminum substrate and the copper foil is solved, so that thelaminating accuracy of the aluminum substrate and the copper foil is improved, and the production efficiency of the aluminum substrate is improved.

Description

technical field [0001] The invention relates to the field of production and processing of aluminum substrates, in particular to an aluminum substrate foil plate pressing device. Background technique [0002] Aluminum substrate is a metal-based copper-clad laminate with good heat dissipation function. Generally, a single-sided panel consists of three layers, which are circuit layer (copper foil), insulating layer and metal base layer. It is commonly used in LED lighting products and has two sides. , the white side is for soldering the LED pins, and the other side shows the natural color of aluminum. Generally, it will be in contact with the heat-conducting part after applying the heat-conducting slurry. The product items cover the whole industry of lighting products, such as commercial lighting, indoor lighting, the application range is getting bigger and bigger, and the use and economic value are getting bigger and bigger. [0003] High thermal conductivity aluminum substra...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B37/10B32B37/00B32B38/18B32B15/01B65G47/52B65G47/90H05K3/02
CPCB32B37/10B32B37/0046B32B38/1833B32B15/017B65G47/52B65G47/90H05K3/022
Inventor 陈庆祝
Owner 山西鼎隆智装科技股份有限公司
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