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Diode chip acid washing equipment

A technology for pickling equipment and diodes, applied in the field of diodes, can solve the problems of incomplete treatment, deviation of the conduction effect of finished products, etc., and achieve the effect of convenient pouring

Inactive Publication Date: 2020-07-31
夏相堂
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above-mentioned technical problems, the present invention provides a pickling equipment for diode chips to solve the problem that the diode chips are in the state of stacking layers and are affected by the soaking state of pickling water, which makes it easy to make the chips tightly bonded. together, so that only a small amount of internal bonding can be contacted with the pickling solution. After the pickling is completed, the bonded chip is not fully in contact with the pickling solution, which leads to incomplete processing. The finished product made by it The problem that the conduction effect will be biased

Method used

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  • Diode chip acid washing equipment
  • Diode chip acid washing equipment
  • Diode chip acid washing equipment

Examples

Experimental program
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Effect test

Embodiment 1

[0029] as attached figure 1 to attach Figure 7 Shown:

[0030] The invention provides a pickling device for diode chips, the structure of which includes a protective flip cover 1, a diode support pickling device 2, a chassis 3, a support foot 4, a liquid discharge head 5, and an infusion head 6. The protective flip cover 1 and the chassis 3 Connected by hinges, the inside of the chassis 3 is provided with a diode support pickling device 2, and there are four supporting feet 4 fixedly installed at the four corners of the bottom of the supporting feet 4, and the liquid discharge head 5 is located below the infusion head 6 And both of them are embedded and fixed on the right side of the cabinet 3 .

[0031] The diode support pickling device 2 includes an pickling inner tank 21, a support bar 22, and a hanging mechanism 23. The pickling inner tank 21 is arranged inside the cabinet 3, and the support bar 22 is provided with two And the left and right ends are all embedded in t...

Embodiment 2

[0039] as attached Figure 7 Shown:

[0040] The present invention provides a pickling device for diode chips. The taper sleeve a353 includes an inner groove bar 531, a floating sheet 532, and a top sheet 533. The inner groove bar 531 is arranged inside the floating sheet 532, and the floating sheet 532 is embedded in the Inside the top sheet 533, there are four floating sheets 532 and there are three inner grooves 531 in each floating sheet, which can generate a powerful gas in the pickling solution through its foam material and the gas sealed in the middle. of buoyancy.

[0041] Wherein, the outer surface of the stacked ring aa3 is protruding, and the inner surface is provided with layers of folds, which can greatly expand its extension length through folding and unfolding.

[0042] Wherein, the bottom of the elastic bar a352 is thick and the top is thin. There are four elastic bars a352, which can be extended in all directions to constrain the taper sleeve a353.

[0043]...

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Abstract

The invention provides diode chip acid washing equipment, which structurally comprises a protective flip cover, a diode supporting and hanging acid washing device, a case, supporting legs, a liquid discharging head and a liquid conveying head, wherein the protective flip cover is connected with the case through a hinge, the diode supporting and hanging acid washing device is arranged in the case,the four supporting legs are fixedly installed at the four corners of the bottoms of the supporting legs, the liquid discharging head is positioned below the liquid conveying head, and the liquid discharging head and the liquid conveying head are both embedded and fixed on the right side surface of the case. According to the invention, when a diode chip is placed in an acid washing tank, floatingstrips can be pushed out upwards through the buoyancy of an acid washing solution on the floating strips, so that the dense floating strips can fully separate the chip placed on a filter screen, the chip can be fully and directly soaked and contacted by the acid washing solution; and when the chip is taken out, the floating strips can retract through traction of floating sheets in the floating strips, so that the chip is convenient to pour out.

Description

technical field [0001] The invention belongs to the field of diodes, and more specifically relates to pickling equipment for diode chips. Background technique [0002] Diode chip pickling When pickling, because the batch-type diode chip pickling is put into the pickling pool together, the outer surface of the diode chip can be pickled by the pickling reaction, and then the surface can be pickled through sufficient contact deal with. [0003] Based on the above description, the inventors found that the existing pickling equipment for diode chips mainly has the following deficiencies, such as: [0004] Since the diode chips are stacked layer by layer and affected by the soaking state of pickling water, it is easy to make the chips stick together tightly, so that only a small amount of internal bonding can be in contact with the pickling solution. After the completion, the bonded chip is not fully in contact with the pickling solution, which leads to incomplete treatment, and...

Claims

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Application Information

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IPC IPC(8): H01L21/67B08B3/08B08B3/10
CPCB08B3/08B08B3/10H01L21/67057
Inventor 夏相堂
Owner 夏相堂