A vertical glue filling machine for micro flat wire metallographic observation

A technology of glue filling machine and flat wire, which is applied to the field of wire vertical glue filling equipment

Active Publication Date: 2022-01-18
WELL ASCENT ELECTRONIC (GANZHOU) CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The technical problem to be solved by the present invention is to provide a vertical glue filling machine for metallographic observation of fine flat wires. This technical solution solves the problem that the flat wire is perpendicular to the bottom of the glue filling space when filling glue

Method used

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  • A vertical glue filling machine for micro flat wire metallographic observation
  • A vertical glue filling machine for micro flat wire metallographic observation
  • A vertical glue filling machine for micro flat wire metallographic observation

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Embodiment Construction

[0041] In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0042] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "front", "rear", "vertical", "horizontal", The orientation or positional relationship indicated by "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have Certain orientations, constructed and operative in certain orientations, therefore are not t...

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Abstract

The invention relates to the field of vertical glue filling equipment for wire rods, in particular to a vertical glue filling machine for metallographic observation of fine flat wires, which includes a glue filling mechanism, a linear lifting mechanism, a hinged cylinder mold frame, a detachable rubber mold, The first pair of shaft lockers, the second pair of shaft lockers, the fixed abutment, the first magnet and the second magnet, the hinged cylinder formwork and the glue filling mechanism are vertically arranged on both sides of the linear lifting mechanism, which can be The detachable rubber mold is set coaxially inside the hinged cylinder mold base, the discharge end of the glue filling mechanism is connected with the detachable rubber mold through a hose, and the first pair of shaft lockers are set at the working end of the linear lifting mechanism, fixed against The connector is set at the bottom of the linear lifting mechanism, and the magnets are respectively set at the bottom of the second pair of shaft lockers and the fixed abutment. In the working state, the two ends of the flat wire are coaxially connected through the working end of the locker. , the device is easy to operate, can produce metallographic observation samples of different shapes, and can ensure that the flat line is always perpendicular to the bottom of the glue filling space.

Description

technical field [0001] The invention relates to the field of vertical gluing equipment for wire rods, in particular to a vertical gluing machine for metallographic observation of fine flat wires. Background technique [0002] Metallographic refers to the chemical composition of metal or alloy and the physical state and chemical state of various components inside the alloy. Metallographic structure reflects the specific form of metallographic phase, such as martensite, austenite, ferrite, pearlite etc. The generalized metallographic structure refers to the mixed state and interaction state of two or more substances in the microscopic state. [0003] However, the fine flat wires will appear in different states after being glued, and a vertical glue filling machine that can produce samples for metallographic observation is now needed. [0004] Chinese patent CN201811644134.1 discloses a micro flat wire glue filling mold and a grinding method for the cross section of the micro...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B29C39/10B29C39/22B29C39/26B29C39/24B29C39/36
CPCB29C39/10B29C39/22B29C39/26B29C39/24B29C39/36
Inventor 陈永新朱祚茂
Owner WELL ASCENT ELECTRONIC (GANZHOU) CO LTD
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