an integrated circuit module

Abstract

The embodiment of the present invention discloses an integrated circuit module, including a PCB board for carrying printed circuits and electronic components and a heat dissipation assembly for dissipating heat for the PCB board, stacking blocks are arranged at both ends of the PCB board, and The upper and lower sides of the stacking block are provided with connecting grooves for connecting printed circuits or electronic components on the PCB board, and the end of the stacking block away from the PCB board is rotatably connected with a connecting plate, which slides on the connecting plate It is connected with a connecting component for fixing the heat dissipation component and connecting two PCB boards. When in use, the quick connection between two adjacent PCB boards can be realized through the stacking block and the connecting component, which can effectively reduce the In addition, when stacking, through the heat dissipation components set up, the principle of hot air rising can be used to realize the rapid exchange of air, ensuring that when it is placed in a closed space, it can be quickly removed. The heat is directed to the outside.

Description

technical field [0001] The invention relates to the technical field of integrated circuits, in particular to an integrated circuit module. Background technique [0002] An integrated circuit is a miniature electronic device or component that interconnects transistors, resistors, capacitors, inductors and other components and wiring required in the circuit to complete certain functions. This kind of circuit becomes an integrated circuit. It is widely used in computers, measuring instruments and other aspects due to the advantages of few points, low power consumption, and high stability. [0003] With the continuous development of science and technology, electronic equipment is becoming more and more sophisticated and miniaturized. When integrating integrated circuits with multiple functions onto a small PCB board, the more advanced the process technology used, the more produced The volume of the product will be smaller, but correspondingly with the improvement of the manufac...

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Problems solved by technology

[0005] For this reason, the embodiment of the present invention provides an integrated circuit module to solve the problem of stacking integrated circuit boards by direct welding in the prior art. Not only is it not easy to repair when a fault occurs, but also direct stacking of boards will Difficult to dissipate heat

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