Equivalent thermal modeling method for via hole structure

Abstract

The invention relates to an equivalent thermal modeling method for a via hole structure. The equivalent thermal modeling method comprises the following steps: 1, constructing an original model of a single via hole structure with a buffer block structure; 2, applying boundary conditions and a heat source to the original model to obtain an average temperature of a plane where the heat source is located; 3, replacing an original via hole area with a square column with the volume equal to that of the via hole area, and constructing an equivalent model; 4, applying a boundary condition and a heat source which are the same as those of the original model to the equivalent model, performing parameter scanning on the thermal conductivity of the square column, and determining the equivalent thermalconductivity of the square column; 5, repeating the steps 1-4 according to different ratios of the thickness of the via hole copper layer to the radius of the via hole in the via hole area, and extracting the equivalent thermal conductivity of the corresponding square column; 6, obtaining an equivalent thermal conductivity model of the square column by using a parameter fitting method; and 7, realizing equivalent thermal modeling of the multi-via-hole array structure according to the equivalent thermal conductivity model of the square column. Compared with the prior art, the method has the advantages of simple implementation process, high model accuracy, wide application range and the like.

Description

technical field [0001] The invention relates to the technical field of microelectronic packaging, in particular to an equivalent thermal modeling method for a via structure. Background technique [0002] With the development of electronic packaging technology, the power density of electronic systems continues to increase, and the problem of heat dissipation is becoming more and more serious. Excessive temperature will affect the reliability of electronic components, and even lead to the failure of the entire electronic system. Thermal management is therefore an important issue faced by electronic systems. Vias are widely used in electronic packaging structures and printed circuit boards for electrical interconnection in the vertical direction and heat transfer and diffusion. Therefore, as an important part of an electronic system, it is necessary to accurately evaluate its heat transfer characteristics. [0003] The methods for evaluating the heat transfer performance of ...

AI Technical Summary

Problems solved by technology

This method mainly deals with solid via structures, but the accuracy of the model is not high, and it is not suitable for common metallized vias

The numerical method based on finite element is used to model the structure of real vias in detail, which has high accuracy. However, when the number of vias is large and the distribution is uneven, a large number of meshes need to be divided, which consumes high computing resources and reduces the overall computing efficiency. Low

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