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Semiconductor package with shielding structure and preparation method of semiconductor package

A shielding structure, semiconductor technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as poor electromagnetic shielding effect and peeling off of electromagnetic shielding layer

Inactive Publication Date: 2020-08-11
苏州容思恒辉智能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing semiconductor packages have defects such as poor electromagnetic shielding effect and peeling off of the electromagnetic shielding layer.

Method used

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  • Semiconductor package with shielding structure and preparation method of semiconductor package
  • Semiconductor package with shielding structure and preparation method of semiconductor package

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Embodiment Construction

[0024] In order to better understand the technical solutions of the present invention, the embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings.

[0025] It should be clear that the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0026] Terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. As used in the embodiments of the present invention and the appended claims, the singular forms "a", "said" and "the" are also intended to include the plural forms unless the context clearly indicates otherwise.

[0027] It should be understood that the term "an...

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Abstract

The invention relates to a semiconductor package with a shielding structure and a preparation method of semiconductor package. The method comprises the following steps: cutting the semiconductor waferto form a single semiconductor die, arranging a plurality of semiconductor tube cores on a bearing base material, depositing a dielectric material on the bearing base material to form a dielectric layer, and then sequentially forming a first composite shielding layer, a first resin packaging layer, a second composite shielding layer, a second resin packaging layer and a third composite shieldinglayer on the bearing base material, and forming a third resin packaging layer on the bearing base material.

Description

technical field [0001] The invention relates to the field of semiconductor packaging, in particular to a semiconductor packaging with a shielding structure and a preparation method thereof. Background technique [0002] For the existing semiconductor package with shielding structure, in the manufacturing process, the chip is usually first arranged on the circuit substrate, and then the chip is wrapped with encapsulant, and then the shielding structure is arranged on the encapsulant Another way is to first set the chip on the circuit substrate, then add metal fillers to the resin material, and then cover the circuit substrate and the chip with the resin material with metal fillers to form an encapsulant, that is, to package Colloid has electromagnetic shielding effect. However, the existing semiconductor package has defects such as poor electromagnetic shielding effect and peeling off of the electromagnetic shielding layer. Contents of the invention [0003] The object of...

Claims

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Application Information

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IPC IPC(8): H01L23/552H01L21/56H01L23/31
CPCH01L21/56H01L23/3121H01L23/552
Inventor 赵慧
Owner 苏州容思恒辉智能科技有限公司
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