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Manufacturing method of auxiliary carrier for improving small plate cleaning

A production method and substrate production technology, applied in the cleaning/polishing of conductive patterns, secondary treatment of printed circuits, etc., can solve problems affecting product quality, poor oxidation, and easy oxidation of products, so as to improve cleaning and operation efficiency and ensure Installation, no loose and shaking effect

Active Publication Date: 2020-08-21
VICTORY GIANT TECH HUIZHOU CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the development of electronic information, the thickness of PCB products is becoming thinner and thicker, and the imposition is developing towards the two extreme directions of large and small. In the direction of imposition to small development, some products require delivery of finished PCBs due to the demand for SMT parts. Contiguous shipments are not allowed, and single PCS shipments cannot be cleaned horizontally after forming and cutting, thus affecting product quality
[0003] The delivery of finished products does not allow contiguous delivery, and single PCS delivery is required (currently the minimum 15mm*20mm), which leads to the inability to clean horizontally after molding and FQC. The traditional way to improve the cleaning of small boards is to use high-pressure air guns for manual cleaning. Due to manual operations, Unable to effectively remove the PP dust on the surface of the board after molding
The conventional production process of the product: pre-process→forming→manual air gun cleaning→FQC→packaging. This conventional production has the following disadvantages: 1. The finished product cannot be cleaned after forming, and the dust residue on the board can be improved by manual air gun cleaning; 2. After FQC, due to imposition Too small, the equipment roller spacing is designed to be at least about 30mm, the product size exceeds the current industry equipment design capability, and horizontal deoxidation cleaning cannot be performed. After the FQC inspection board is directly sent to the packaging, the product is prone to poor oxidation after the FQC inspection board
The use of manual air gun cleaning above can improve the residue of PP powder on the board surface to a certain extent, but it cannot be completely solved, and after FQC inspection, the board cannot be deoxidized and cleaned horizontally, and the product is easy to oxidize, which affects the solderability of the product.

Method used

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  • Manufacturing method of auxiliary carrier for improving small plate cleaning
  • Manufacturing method of auxiliary carrier for improving small plate cleaning
  • Manufacturing method of auxiliary carrier for improving small plate cleaning

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0035] refer to Figure 1 to Figure 3 , a non-limiting embodiment of the present invention, a method of manufacturing an auxiliary carrier for improving the cleaning of small plates, the prepared auxiliary carrier is used in the product manufacturing process to clean the product, and the product manufacturing process: the previous process→ Forming → special carrier auxiliary cleaning → FQC → special carrier auxiliary cleaning → packaging. The manufacturing method of the special auxiliary carrier includes the following steps,

[0036] S1: Production of carrier base plate 1: select a plate whose thickness is more than 0.5mm larger than the actual product plate thickness as carrier base plate 1, so as to ensure that the product can be put into the controlled depth while retaining the excess thickness in the subsequent controlled depth milling. The surface of the product after the tank 3 is lower than the surface of the carrier, which effectively prevents the product from falling...

Embodiment 2

[0047] refer to figure 2 and image 3 , a non-limiting embodiment of the present invention, the present invention also provides an auxiliary carrier for improving small plate cleaning obtained by the above manufacturing method, including a carrier substrate 1, and the carrier substrate 1 is processed by controlled depth milling There are a plurality of depth-controlling grooves 3 distributed in an array, and water-guiding grooves 2 vertically distributed to the length direction of the depth-controlling grooves 3 , and the water-guiding grooves 2 and the depth-controlling grooves 3 are connected. The position corresponding to the window opening of the actual product in the control depth groove 3 is provided with a window opening position 31, and the window opening position is to open the window at the non-covered oil position on the PCB surface solder resistance leakage copper surface; A plurality of cleaning and exchanging holes 33 are provided at the position, that is, the ...

Embodiment 3

[0049] refer to figure 2 and image 3 , a non-limiting embodiment of the present invention, the present invention also provides a method for cleaning a small plate, after the small plate is processed in the previous process and formed, the above-mentioned auxiliary carrier is used to clean the small plate for the first time, and the first time Cleaning uses high-pressure water washing and ultrasonic water washing. Described cleaning for the first time comprises the following steps,

[0050] S1: placing the molded plate in the depth control groove 3 on the carrier;

[0051] S2: Turn on the horizontal cleaning line, control the depth and thickness surface 32 downwards, and transfer the carrier through the equipment feeding section;

[0052] S3: After the finished board is cleaned horizontally with the aid of the carrier, the carrier is turned 180° in the discharge section and then poured into the board receiving frame and sent to the next process.

[0053] refer to figure...

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PUM

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Abstract

The invention relates to a manufacturing method of an auxiliary carrier for improving small plate cleaning. The method comprises the following steps: S1, manufacturing a carrier substrate: selecting aplate of which the thickness is 0.5 mm greater than that of an actual product plate as the carrier substrate; S2, conducting depth control groove processing: specifically, carrying out depth controlmilling on the carrier base plate according to the actual product delivery appearance to form a plurality of depth control grooves used for containing products, and reserving the residual thickness between the depth control grooves and the bottom of the carrier base plate; S3, windowing treatment: carrying out windowing treatment on a position corresponding to the excess thickness surface of the depth control groove according to solder mask windowing of an actual product; and S4, drilling treatment, specifically, carrying out drilling on the area except the area where windowing treatment is conducted on the controlled deep groove, and the drilling treatment including that a plurality of cleaning exchange holes are drilled through a conventional drilling manufacturing method. The manufacturing method of the auxiliary carrier for improving small plate cleaning has the advantages that the product quality is improved, the cleaning requirements of different product sizes can be met, and thefixing effect is good.

Description

technical field [0001] The invention relates to the technical field of circuit board manufacturing, in particular to a method for manufacturing an auxiliary carrier for improving cleaning of small boards. Background technique [0002] With the development of electronic information, the thickness of PCB products is becoming thinner and thicker, and the imposition is developing towards the two extreme directions of large and small. In the direction of imposition to small development, some products require delivery of finished PCBs due to the demand for SMT parts. Contiguous shipments are not allowed, and single PCS shipments cannot be cleaned horizontally after forming and cutting, thus affecting product quality. [0003] The delivery of finished products does not allow contiguous delivery, and single PCS delivery is required (currently the minimum 15mm*20mm), which leads to the inability to clean horizontally after molding and FQC. The traditional way to improve the cleaning ...

Claims

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Application Information

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IPC IPC(8): H05K3/26
CPCH05K3/26
Inventor 赵林飞李剑华朱晓辉周卫卫罗练军王辉
Owner VICTORY GIANT TECH HUIZHOU CO LTD