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LED chip scale packaging method capable of emitting light from side surface

A technology of LED chip and side light emission, applied in the direction of electrical components, circuits, semiconductor devices, etc., can solve the problems of converting light into heat, shortening the life of the light source, reducing the reliability and safety of the light source, etc.

Pending Publication Date: 2020-08-25
JIANGSU LUOHUA NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The most notable advantage of CSP LEDs is high luminous efficiency, but there are some problems in the single-sided CSP lamp beads currently on the market: 1. The white glue around the single-sided CSP light source in the prior art blocks the side light output of the light-emitting chip, so The brightness of the light source will decrease. 2. At the same time, because the white glue blocks the light from the side of the light-emitting chip, the light will be reflected and refracted many times. , so the life of the light source is shortened

Method used

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  • LED chip scale packaging method capable of emitting light from side surface
  • LED chip scale packaging method capable of emitting light from side surface
  • LED chip scale packaging method capable of emitting light from side surface

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Embodiment Construction

[0028] The object of the present invention is to provide a CSP LED manufacturing process with side light emission and three side light emission

[0029] In order to realize the object of the present invention, the following technical solutions are provided:

[0030] Two-sided light (single side)

[0031] 1. If figure 1 As shown, the chips 2 are arranged into a 30×30 matrix by using a precision chip arrangement machine, and the chip arrangement accuracy is required to be ±5 μm, and the angle deflection is <1°. The distance between chips is between 0.376~0.466μm. When the crystal is arranged, the electrode of the chip 2 faces upward, and the light-emitting surface of the chip is in contact with the die-bonding film 1 . Die-bonding film 1 is a double-sided adhesive PET film, both sides of which are coated with 2-5 μm thick pyrolytic glue. One side of the die-bonding film 1 is closely attached to the mask glass, and the other side is adhered to the chip 2 .

[0032] 2. Lamin...

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Abstract

The invention provides an LED chip scale packaging method capable of emitting light from a side surface. Firstly, a heating wire in the lower mold is used for heating; before the fluorescent resin isnot completely cured, the cooling part is used for cooling towards the heat dissipation metal plate so as to form a temperature gradient in the vertical direction of the fluorescent resin, so that concave-convex fluctuation is formed on the surface of the fluorescent resin, a roughened surface is formed, then the heating work of the heating wire is stopped, the fluorescent resin is cooled to the room temperature, and the roughening and curing steps are completed.

Description

technical field [0001] The invention relates to the field of LED packaging, belongs to the classification number H01L33 / 00, and specifically relates to a side-emitting LED chip-level packaging method. Background technique [0002] CSP (Chip Scale Package, Chip Scale Package), which consists of a flip chip in the center and fluorescent glue around the flip chip. When in use, the CSP light source can be directly welded on the substrate by solder to realize light emission, which saves the wire bonding process, thus improving the packaging efficiency. The most notable advantage of CSP LEDs is high luminous efficiency, but there are some problems in the single-sided CSP lamp beads currently on the market: 1. The white glue around the single-sided CSP light source in the prior art blocks the side light output of the light-emitting chip, so The brightness of the light source will decrease. 2. At the same time, because the white glue blocks the light from the side of the light-em...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L33/48H01L33/50H01L33/52
CPCH01L33/48H01L33/50H01L33/52
Inventor 罗雪方薛水源陈文娟王林燕
Owner JIANGSU LUOHUA NEW MATERIAL