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A packaging mold and a packaging method

A packaging method and mold technology, applied in electrical components, semiconductor/solid-state device manufacturing, circuits, etc., can solve problems such as the inability to discharge the air in the molding area, the residual air warping, and the reduction of production capacity output.

Pending Publication Date: 2020-09-01
ADVANCED SEMICON ENG INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above-mentioned method will not only greatly reduce the output of production capacity, but also cause the vacuum pumping function to be turned off because the mold flow in the side runner will quickly flow to the exhaust area, so that the air in the molding area cannot be discharged smoothly, resulting in residual air backpacking Phenomena and warping and other issues

Method used

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  • A packaging mold and a packaging method
  • A packaging mold and a packaging method
  • A packaging mold and a packaging method

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Embodiment Construction

[0024] Common reference numbers are used throughout the drawings and embodiments to refer to the same or similar components. Embodiments of the present invention will be more readily understood from the following detailed description taken in conjunction with the accompanying drawings.

[0025] The following disclosure provides many different embodiments, or examples, for implementing different features of the presented subject matter. Specific examples of components and arrangements are described below to illustrate certain aspects of the disclosure. Of course, these components, values, operations, materials and arrangements are examples only and are not intended to be limiting. For example, in the description provided herein, the formation of a first feature over or on a second feature may include embodiments where the first feature and the second feature are formed or disposed in direct contact, and may also include additional features Embodiments may be formed or dispose...

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Abstract

A packaging mold comprises a mold body, two first cavities and a plurality of second cavities. The mold body is provided with at least one mold sealing area. The two first cavities are connected withthe mold body, each first cavity is provided with a containing cavity and at least one connecting channel, and the connecting channels are communicated with the mold sealing area and the containing cavities. The second cavities are connected with the mold body, each second cavity is provided with a material containing cavity and at least one feeding pouring channel, and the feeding pouring channels communicate with the mold sealing area and the material containing cavities. The volume of the connecting channel of the first cavity is larger than or equal to the volume of the feeding pouring channel of the second cavity.

Description

technical field [0001] The invention relates to a packaging mold and a packaging method, and more specifically, to a packaging mold and a packaging method for improving packaging mold flow. Background technique [0002] In order to avoid excessive process costs, high-complexity packaging products of different types or sizes will try to share the same set of molds when molding. However, due to the fixed volume of the mold cavity, the array combinations of different product sizes are different, so that the volume of the side runners on both sides will also be different from the mold sealing area in the middle, which will easily cause the mold flow between the two to be different. The phenomenon of uniformity, and lead to problems such as the products in the last row are not molded or molded incompletely. At present, on the production line, the production design is generally done at the expense of the last row or the products with the last two to three rows. However, the abov...

Claims

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Application Information

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IPC IPC(8): B29C45/26B29C45/27H01L21/56
CPCB29C45/26B29C45/2701H01L21/565B29C2045/2683
Inventor 简子杰陈熙洪曾乙修
Owner ADVANCED SEMICON ENG INC