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Plane target unbinding device and method

A planar target and unbundling technology, which is applied in metal material coating process, ion implantation plating, coating, etc., can solve the problems of multi-indium solder, difficult to separate, etc.

Active Publication Date: 2020-09-01
FUJIAN ACETRON NEW MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, when the device is used for unbinding, there will be more indium solder remaining on the residual target and the back plate, and the copper wire and indium solder during the unbinding process will be mixed together and fall into the indium basket, making it difficult to separate

Method used

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  • Plane target unbinding device and method
  • Plane target unbinding device and method

Examples

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Embodiment 1

[0066] Unbinding the planar target by using the planar target unbinding device provided by the present invention includes the following steps:

[0067] (a) Planar target washing: wipe off the dust on the surface of the planar target with a clean cloth, then put the planar target into an ultrasonic cleaning machine, ultrasonically wash it with deionized water for 25 minutes, take it out and dry it for use; wherein, the The planar target material includes a waste target, an indium solder layer and a copper back plate that are stacked in sequence, and several copper wires are arranged in the indium solder layer;

[0068] (b) Removing the backsplash film: use a sandblasting gun to perform sandblasting on the position of the backsplash film in the cleaned planar target to remove the backsplash film and obtain a pretreated target:

[0069] (c) Infrared heating melting indium: put the pretreatment target on the conveying device 1, and the copper back plate is in contact with the upper ...

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Abstract

The invention provides a plane target unbinding device and method, and belongs to the technical field of target unbinding. The plane target unbinding device can achieve plane target unbinding. A conveying device is used for achieving conveying of plane targets in all areas, an infrared heating device is used for carrying out infrared heating on the plane targets, and melting of indium welding fluxin the plane targets is achieved. All components in an indium removing device are reasonably arranged, indium welding flux attached to a back plate and waste targets can be effectively scraped away (the back plate can be directly put into secondary use), the indium welding flux recycling rate is high (the recycling rate can reach 97% or above), automatic separation of the indium welding flux andcopper wires can be achieved, the secondary separation of the indium welding flux and the copper wires is avoided, and the treatment efficiency is improved. In addition, the plane target unbinding device can achieve automatic large-batch plane target unbinding, a large amount of manpower is saved, and the unbinding efficiency is greatly improved.

Description

technical field [0001] The invention relates to the technical field of target unbinding, in particular to a planar target unbinding device and method. Background technique [0002] In recent years, due to the rapid development of the electronic display industry, the demand for magnetron sputtering targets is also increasing. The magnetron sputtering target consists of two parts, the target and the back plate, and the bonding process of the target and the back plate is usually called target binding. The general process of target binding is as follows: first metallize the surface of the target and the back plate, and then evenly lay several copper wires with a diameter of 0.2 to 1 mm on the back plate to ensure that the thickness of the indium solder layer is uniform during brazing. Finally the solder bond is done with indium solder. [0003] Generally, the utilization rate of planar targets is low, generally only about 30-40%, and the cost of the backplane is relatively exp...

Claims

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Application Information

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IPC IPC(8): C23C14/35C22B7/00C22B58/00
CPCC23C14/35C23C14/3407C22B7/005C22B58/00Y02P10/20
Inventor 黄先彬张科李康李强
Owner FUJIAN ACETRON NEW MATERIALS CO LTD
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