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Multi-layer circuit board automatic pressing equipment

A technology of multi-layer circuit boards and lamination equipment, applied in the directions of multi-layer circuit manufacturing, printed circuit, printed circuit manufacturing, etc. and other problems to achieve the effect of ensuring the pass rate, improving production efficiency, and realizing the optimal allocation of resources

Active Publication Date: 2021-11-30
江苏拓斯达机器人有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in related technologies, workers usually manually press and laminate composite multilayer boards and PET, which not only consumes a lot of manpower, but also has low efficiency under the requirements of high output. Matching accuracy

Method used

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  • Multi-layer circuit board automatic pressing equipment
  • Multi-layer circuit board automatic pressing equipment
  • Multi-layer circuit board automatic pressing equipment

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Embodiment Construction

[0061] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0062] It should be noted that all directional indications (such as up, down, left, right, front, back...) in the embodiments of the present invention are only used to explain the relationship between the components in a certain posture (as shown in the accompanying drawings). Relative positional relationship, movement conditions, etc., if the specific posture changes, the directional indication will also change accordingly.

[0063] In the present in...

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PUM

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Abstract

The invention discloses an automatic lamination device for a multilayer circuit board. The automatic lamination device for a multilayer circuit board includes a composite board feeding mechanism, a flexible board feeding mechanism and a pressing mechanism. The composite board feeding mechanism has sequentially arranged feeding The station, the retrieving station and the unloading station, the composite board transport mechanism is used to transport the composite circuit board from the loading station to the reclaiming station; the flexible board transport mechanism has a pressing station, and the flexible board transport The material mechanism is used to transport the flexible circuit board to the pressing station; the pressing mechanism is used to move the composite circuit board at the reclaiming station to the pressing station for pressing with the flexible circuit board at the pressing station Finally, it is transported to the unloading station via the press-fitting mechanism and the composite plate delivery mechanism. The technical solution of the present invention is aimed at realizing automatic lamination of composite circuit boards and flexible circuit boards, greatly improving production tempo and output, ensuring lamination accuracy, and effectively reducing manual work intensity.

Description

technical field [0001] The invention relates to the technical field of automation equipment, in particular to an automatic pressing equipment for multilayer circuit boards. Background technique [0002] With the development of science and technology, the printed circuit board (Printed Circuit Board, referred to as PCB) manufacturing industry has developed rapidly. The manufacturing level is constantly developing towards high precision, high density and high reliability. During the preparation process of the multilayer board, it is necessary to carry out a step of pressing and assembling with a flexible circuit board (Polyethyleneterephthalate, PET for short). However, in related technologies, workers usually manually press and laminate composite multilayer boards and PET, which not only consumes a lot of manpower, but also has low efficiency under the requirements of high output. Matching precision. [0003] The above content is only used to assist in understanding the te...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/46B65G49/06
CPCB65G49/06B65G49/061B65G49/067H05K3/4611H05K2203/0147
Inventor 陈开放吴丰礼王恒基于水才
Owner 江苏拓斯达机器人有限公司
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