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Method and apparatus for cutting a display motherboard

A display panel and motherboard technology, which is applied in the direction of instruments, organic semiconductor devices, optics, etc., can solve the problems that affect the production yield, product stability, the edge of the display panel is easily damaged, and the strength of the display panel is reduced, so as to eliminate cutting Effects of bad, improved cutting quality, and improved reliability

Active Publication Date: 2022-07-22
WUHAN TIANMA MICRO ELECTRONICS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, under the current cutting process conditions, the position of the cutting line in the display motherboard needs to bear a relatively large cutting stress. Easy to be damaged, prone to defects such as chipping, resulting in a decrease in the strength of the cut display panel, affecting production yield and product stability in subsequent processes

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  • Method and apparatus for cutting a display motherboard
  • Method and apparatus for cutting a display motherboard
  • Method and apparatus for cutting a display motherboard

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Embodiment Construction

[0037] In order to better understand the technical solutions of the present invention, the embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0038] It should be understood that the described embodiments are only some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0039] The terms used in the embodiments of the present invention are only for the purpose of describing specific embodiments, and are not intended to limit the present invention. As used in the embodiments of the present invention and the appended claims, the singular forms "a," "the," and "the" are intended to include the plural forms as well, unless the context clearly dictates otherwise.

[0040] It should be understood that the term "an...

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Abstract

Embodiments of the present invention provide a method and device for cutting a display motherboard, which relate to the field of display technology and are used to alleviate the problem of stress concentration during cutting of the display motherboard and reduce defects such as edge chipping. The display motherboard includes a plurality of display panels, and the method includes: coating a first surface of the display motherboard with an anti-stress concentration material along a preset cutting line of the display motherboard, and the preset cutting line is located on two adjacent display panels between; on the first surface of the display motherboard, cutting the display motherboard along a preset cutting line, forming a first cutting slit on the display motherboard; dividing the display motherboard along the first cutting slit to obtain at least two separate display panel.

Description

【Technical field】 [0001] The present invention relates to the field of display technology, and in particular, to a method and device for cutting a display motherboard. 【Background technique】 [0002] At present, in the manufacturing process of a display panel, a plurality of display panels with smaller size are usually first formed in a display motherboard with a larger area. Then, the display panel of the target size is cut and separated from the display mother board through a cutting process. However, under the current cutting process conditions, the position of the cutting line in the display motherboard needs to bear a large cutting stress. During cutting and subsequent peeling, that is, during the process of dividing to form different small-sized display panels, the edge of the display panel is extremely It is easily damaged, and defects such as chipping are prone to occur, which leads to a decrease in the strength of the cut display panel, which affects the production...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L51/56G02F1/13G02F1/1333
CPCG02F1/133351G02F1/1303H10K71/851H10K71/00
Inventor 肖晗
Owner WUHAN TIANMA MICRO ELECTRONICS CO LTD
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