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Heat dissipation device and application thereof

A heat sink and combined technology, applied in the field of additive manufacturing, can solve the problems of metal bulge deformation, low laser absorption rate, and inability to form metal parts, so as to reduce bulge and improve forming efficiency.

Active Publication Date: 2020-09-08
TSC LASER TECH DEV BEIJING CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the process of using laser selective melting additive manufacturing technology to print metal devices, due to the low laser absorption rate of the metal itself, a large amount of laser heat is lost to the surrounding powder and formed parts during the laser selective melting process, which makes the metal prone to bulge deformation, which in turn leads to Metal parts cannot be formed by laser selective melting technology

Method used

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  • Heat dissipation device and application thereof
  • Heat dissipation device and application thereof
  • Heat dissipation device and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0058] An additive manufacturing method provided by an embodiment of the present invention includes the following steps:

[0059] Step 1: In the three-dimensional software, select the plane where the bottom of the disc structure of the metal device 1 is located, and the design margin is 0.1mm downward along the axis.

[0060] Step 2: Design the reference groove 12 of the circular wire cutting process based on the bottom of the design margin. The wire cutting process reference groove 12 is 0.1 mm away from the lower bottom surface of the metal device 1 and has a depth of 0.1 mm along the radial direction of the cylindrical heat conducting structure 10.

[0061] Step 3: Select the bottom surface of the design margin of the metal device 1, and design a cylindrical heat conducting structure 10 along the axial direction at the center of the disc structure of the metal device 1. The inner diameter of the cylindrical heat conducting structure 10 is 2mm, and the wall thickness of the cylindr...

Embodiment 2

[0073] An additive manufacturing method provided by an embodiment of the present invention includes the following steps:

[0074] Step 1: In the three-dimensional software, select the plane where the bottom of the square plate structure of the metal device 1 is located, and the axial downward margin is 0.2mm as the design margin.

[0075] Step 2: Design the reference groove 12 of the circular wire cutting process based on the bottom of the design margin. The wire cutting process reference groove 12 is 0.2 mm away from the lower bottom surface of the metal device 1 and has a depth of 0.2 mm along the radial direction of the cylindrical heat conducting structure 10.

[0076] Step 3: Select the bottom surface of the metal device 1 with a design margin, and design a cylindrical heat conducting structure 10 along the axial direction at the center of the square plate structure of the metal device 1. The inner diameter of the cylindrical heat conducting structure 10 is 5mm, and the wall thi...

Embodiment 3

[0088] An additive manufacturing method provided by an embodiment of the present invention includes the following steps:

[0089] Step 1: In the three-dimensional software, select the plane where the bottom of the disc structure of the metal device 1 is located, and the allowance is 0.3mm downward along the axis as the design allowance.

[0090] Step 2: Taking the bottom of the design margin as the reference, design the reference groove 12 of the point line cutting process. The wire cutting process reference groove 12 is 0.3 mm away from the lower bottom surface of the metal device 1, and has a depth of 0.3 mm along the radial direction of the cylindrical heat conducting structure 10.

[0091] Step 3: Select the bottom surface of the design margin of the metal device 1, and design a cylindrical heat conducting structure 10 along the axial direction at the center of the disc structure of the metal device 1. The inner diameter of the cylindrical heat conducting structure 10 is 0mm, and...

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Abstract

The invention discloses a heat dissipation device and an application thereof, which relates to the technical field of additive manufacturing, and is used for solving the problems of deformation and bulging of printed metal devices. The heat dissipation device includes a heat conduction structure, at least one first heat conduction hole opened on the heat conduction structure, and a cylindrical heat conduction structure. The heat conduction structure is fixedly connected to the cylindrical heat conduction structure, and the heat conduction structure is distributed annularly around the cylindrical heat conduction structure. The application of the heat dissipation device in additive manufacturing includes the heat dissipation device provided in the above technical scheme. The heat dissipationdevice provided by the invention is used to be arranged at the bottom of a metal device in the additive manufacturing process to perform heat dissipation and supporting on the metal device in the printing process.

Description

Technical field [0001] The invention relates to the technical field of additive manufacturing, in particular to a heat dissipation device and its application. Background technique [0002] Selective Laser Melting SLM (Selective Laser Melting) additive manufacturing technology uses metal powder as raw material. According to the layered slice information of the 3D CAD model of the molded part, the scanning system controls the laser beam to act on the metal powder in the area to be molded to melt the powder After cooling, it is formed. After scanning a layer, the worktable is lowered to a certain height, and then a layer of powder is spread, and it is melted. It is accumulated repeatedly until the whole metal device is formed. Laser selective area melting of metal 3D printing can directly manufacture metal devices, which has outstanding advantages. [0003] In the process of printing metal devices using laser selective melting additive manufacturing technology, due to the low laser a...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/105B33Y30/00
CPCB33Y30/00Y02P10/25
Inventor 刘普祥刘斌李会敏李广生李澄
Owner TSC LASER TECH DEV BEIJING CO LTD
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