A method and system for automatic feeding control of chip material cake
An automatic feeding and control method technology, applied in general control systems, control/regulation systems, program control, etc., can solve the problems of low feeding efficiency, low production capacity of semiconductor chips, and high failure rate of semiconductor chips. The effect of delivery efficiency, compact structure and simple structure
Active Publication Date: 2021-10-26
ANHUI DAHUA SEMICON TECH CO LTD
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Problems solved by technology
[0003] In order to overcome the defects of the prior art, the present invention provides a method and system for automatic feeding of chip material cakes, which solves the problem of the low efficiency of manual feeding of material cakes, which leads to low production capacity of semiconductor chips, and the difficulty of feeding cakes. During the process, the cake was not inspected for defects, resulting in a high failure rate of semiconductor chips.
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[0044] The technical solutions of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Apparently, the described embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.
[0045] Such as figure 1 As shown, the present embodiment provides a chip material cake automatic delivery control system, including a host computer, an automatic control module, a material cake automatic delivery module, a material cake automatic feeding module, a cake rack automatic processing module and a sensing module;
[0046] Among them, the cake automatic feeding module, cake automatic feeding module, cake rack automatic processing module and sensor module can directly use existing equipment;...
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The invention provides a method and system for controlling automatic delivery of chip cakes. The method includes: an automatic control module sends a movement control command to a drive motor module of the automatic cake delivery module; the drive motor module of the automatic cake delivery module receives the After moving the control command, the material cake discharging module carrying the material cake automatic delivery module moves to the material cake delivery position of the cake stand; the automatic control module sends the material cake delivery control command to the material cake discharging module; the material cake After receiving the cake delivery control command, the feeding module places the cake at the cake delivery position of the cake stand. It solves the problem that the existing manual feeding of cakes is low in efficiency of feeding cakes, resulting in low production capacity of semiconductor chips, and the defect detection of cakes is not carried out during the feeding of cakes, resulting in a high failure rate of semiconductor chips.
Description
technical field [0001] The invention belongs to the field of semiconductor chip manufacturing, and specifically designs a method and system for automatically feeding chip material cakes. Background technique [0002] In the semiconductor chip manufacturing process, chip plastic packaging is a very important link, and material cake delivery is an indispensable process for chip plastic packaging. At present, in the field of semiconductor chip manufacturing, material cake is mainly delivered manually, and the efficiency of feeding material cake is low. , resulting in a low production capacity of the semiconductor chip, and the defect detection of the cake was not carried out during the feeding process of the cake, resulting in a high failure rate of the semiconductor chip. Contents of the invention [0003] In order to overcome the defects of the prior art, the present invention provides a method and system for automatic feeding of chip material cakes, which solves the proble...
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IPC IPC(8): G05B19/418
CPCG05B19/41865G05B19/4189Y02P90/02
Inventor 谢政华陈小飞汪昌来
Owner ANHUI DAHUA SEMICON TECH CO LTD