Sealing structure preparing method and membrane electrode and bipolar plate sealing and connection method
A sealing structure and membrane electrode technology, which is applied in the direction of sealing/supporting devices, circuits, fuel cells, etc., can solve the problems of uneven thickness and poor flatness of the sealing ring, and achieve favorable sealing connection, good flatness, and improved size The effect of precision
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Embodiment 1
[0040] The preparation method cooperates with the mold for preparation. Figure 5 For the exploded view of the mold 200 and the membrane electrode 100 provided for the embodiment of the present application, please refer to Figure 5 , the mold 200 has a mold cavity and a liquid inlet 230 communicating with the mold cavity. Further, the mold 200 includes an upper mold 210 and a lower mold 220 , the upper mold 210 has an upper mold cavity, the lower mold 220 has a lower mold cavity 221 , and the liquid inlet 230 communicates with both the upper mold cavity and the lower mold cavity 221 .
[0041] As shown in the figure, an upper mold cavity is formed on the lower surface of the upper mold 210, and the upper mold cavity has a certain depth (the depth is not limited, mainly related to the compression performance (elasticity) of the sealing ring and the sealing groove of the bipolar plate. depth), the shape of the upper mold cavity is consistent with the shape of the upper glue zo...
Embodiment 2
[0059] Figure 7 The second flow chart of the method for preparing the sealing structure on the membrane electrode 100 provided in the embodiment of the present application, Figure 8 A cross-sectional view of the sealing structure on the membrane electrode 100 provided in the embodiment of the present application. see Figure 7 with Figure 8 , this embodiment also provides a method for preparing a sealing structure on the membrane electrode 100, this embodiment is an improvement on the basis of the technical solution in Example 1, and the technical solution described in Example 1 is also applicable to this embodiment The technical solution disclosed in Embodiment 1 will not be described again. The difference between this embodiment and Embodiment 1 is: before placing the membrane electrode 100 with a frame in the mold 200, a coating is applied to the glue area of the frame. A layer of adhesive is then cured to form an adhesive layer 170 for limiting slippage of the seal...
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Abstract
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