A trajectory planning method for laser profiling process oriented to the evolution of chemical milling

A technology of trajectory planning and laser engraving, which is applied in the direction of program control, instrument, computer control, etc., can solve the problems of three-dimensional surface and I-shaped structure erosion ratio scaling, and achieve the effect of saving process programming preparation time and requiring less experience

Active Publication Date: 2021-05-11
BEIHANG UNIV +1
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Problems solved by technology

[0005] The purpose of the present invention is to propose a trajectory planning method for the laser etching process of the evolution of chemical milling, considering the selection of the actual laser engraving position of the erosion ratio change, the selection of the multiple laser engraving position points and the trajectory planning of the I-shaped structure, Effectively solve the erosion ratio scaling of three-dimensional surface and I-shaped structure

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  • A trajectory planning method for laser profiling process oriented to the evolution of chemical milling
  • A trajectory planning method for laser profiling process oriented to the evolution of chemical milling
  • A trajectory planning method for laser profiling process oriented to the evolution of chemical milling

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Embodiment Construction

[0042] In order to make the purpose, technical solution and advantages of the present invention more clear, detailed description will be given below in conjunction with the accompanying drawings.

[0043] A trajectory planning method for the laser engraving process oriented to the evolution of chemical milling, such as figure 1 shown, including the following steps:

[0044] STEP1: Selection of expected points based on 3D digital modeling of chemical milling parts;

[0045] Read the 3D digital model information of the chemical milling part, and select the desired point of the 3D digital model:

[0046] The expected point can be selected from any fixed position point on the model; or, the expected point can also be selected to obtain the expected point of laser engraving after the discretization of the three-dimensional digital-analog boundary curve;

[0047] Read the coordinate information of the desired point; read the boundary curve or surface information where the desired po...

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Abstract

The invention discloses a trajectory planning method for a laser engraving process oriented to the evolution of chemical milling, which belongs to the laser surface manufacturing technology. The key points of the technology lie in the selection of expected points for the second etching of the three-dimensional digital model of the chemical milling part based on the two evolutions of chemical milling; Selection of expected points for the second laser engraving; position point selection for the first laser engraving; trajectory planning for regular features; trajectory planning for free curve features. The invention establishes the laser engraving trajectory planning based on the evolution of chemical milling with variable erosion ratio, effectively solves the problem of intelligent generation of laser engraving trajectory under different erosion ratio conditions / different chemical milling depth conditions, and can better ensure the improvement of manufacturing accuracy Laser engraving efficiency makes laser engraving manufacturing and processing more intelligent.

Description

technical field [0001] The invention relates to the field of laser manufacturing, in particular to a trajectory planning method for a laser engraving process oriented to the evolution of chemical milling. Background technique [0002] With the design of a large number of stiffener structures for aerospace aircraft mechanism components, the structural form is becoming more and more complex. In order to solve the processing of these complex surface parts, the chemical milling process is adopted for aerospace aircraft structural parts. The laser engraving of the chemical milling pattern is a key step in the entire casing chemical milling process, which is to carve the designed pattern on the protective layer of the chemical milling part and realize the peeling. At present, lasers are widely used at home and abroad to carry out laser engraving of parts chemical milling patterns. [0003] The main difficulties of the existing laser engraving process and method are as follows: F...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G05B19/4099
CPCG05B19/4099G05B2219/32113
Inventor 刘强王健臧辰鑫孙鹏鹏
Owner BEIHANG UNIV
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