Curved surface grinding device and chip extracting method

Abstract

The invention provides a curved surface grinding deice and a chip extracting method. The device is used for realize curved surface grinding of a chip, and comprises a grinding surface supporting cylinder and a grinding sleeve; the grinding sleeve is arranged on the outside of the grinding surface supporting cylinder in a sleeving mode; and the grinding sleeve is used for rotating with the grindingsurface supporting cylinder as the axis and grinding the curved surface of the chip. The curved surface of the chip is ground in a way that the grinding surface supporting cylinder controls the grinding sleeve to rotation; in the process of grinding, as the surface of the grinding sleeve is a curved surface, the grinding sleeve can be in good contact with a position to be ground in the curved surface of the chip in a selectable mode, so the position to be ground in the curved surface of the chip can be ground in a selectable mode, and the situation that metallic contact is ground before an interconnecting wire is ground can be avoided.

Description

technical field [0001] The invention relates to the technical field of semiconductors, in particular to a curved surface grinding device and a chip extraction method. Background technique [0002] When a chip in the package fails, it is necessary to extract the failed chip, that is, the target chip, from the package, and then detect the target chip. [0003] The existing method of extracting the target chip is mainly to use a plane grinding device to grind the interconnection line of the target chip until the metal contact of the target chip is exposed, so as to disconnect the target chip from other chips in the package electrically, and then remove it from the package Extract the target chip. [0004] However, in the process of grinding the interconnect lines of the target chip, due to the unevenness of the chip surface or the large curvature of the chip, the existing planar grinding device will grind the metal contacts before grinding the interconnect lines, resulting in ...

AI Technical Summary

Problems solved by technology

[0004] However, in the process of grinding the interconnect lines of the target chip, due to the unevenness of the chip surface or the large curvature of the chip, the existing planar grinding device will grind the metal contacts before grinding the interconnect lines, resulting in the destruction of the metal contacts. Subsequent probes cannot be effectively connected to metal contacts, which affects the detection of target chips

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