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Chip temperature control test board and temperature control test method thereof

A test bench and chip technology, applied in the field of machining and chip testing, can solve the problems of test parameter interference, influence, water vapor condensation, etc., to achieve the effect of temperature and convenient operation

Pending Publication Date: 2020-10-09
SUZHOU MAKING INTELLIGENT EQUIP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, in the prior art, there are still the following defects in the process of chip processing and testing: first, when adjusting the temperature control, it is impossible to perform convenient and effective heating and cooling control on the test bench, and it is impossible to adjust the surrounding area of ​​the test bench. Conservation of temperature
Second, the test environment cannot be adjusted
Detect the performance parameters of the chip in different ambient temperatures. During the process of adjusting the detection temperature, the water vapor in the air around the monitoring platform under the temperature control adjustment is easy to form water vapor in the environment of changing cold and heat. The formed water vapor It is easy to cause water vapor condensation on the test bench, which will cause interference and influence on the test parameters during the monitoring process of the test bench and chip

Method used

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  • Chip temperature control test board and temperature control test method thereof
  • Chip temperature control test board and temperature control test method thereof
  • Chip temperature control test board and temperature control test method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0033] Such as Figure 1~4 As shown, a chip temperature control test bench includes an operating table arranged on a frame, a sealed cabin 1 is arranged on the operating table, and a drying mechanism 2 and a cooling mechanism 3 connected with the sealed cabin 1 are arranged at one end of the sealed cabin 1 , the sealed cabin 1 is provided with a testing mechanism 5,

[0034] Specifically, the testing mechanism 5 includes a rotating seat 52 arranged in the airtight chamber 1 , on which a turntable 51 is driven, and two groups of temperature-controlled test benches 53 are arranged on the turntable 51 . The temperature control test bench 53 includes a temperature control device arranged in the airtight cabin 1, the temperature control device includes a cooling plate 531 arranged on the turntable 51, a heating plate 532 is arranged on the cooling plate 531; a heat insulating plate is arranged on the heating plate 532 533 , a test carrier 534 is set on the heat shield 533 , and a ...

Embodiment 2

[0037] A temperature control test method for a chip temperature control test bench 53:

[0038]Step 1, adjust the monitoring environment of the airtight cabin 1; adjust the ambient temperature and humidity of the airtight cabin 1 through the drying mechanism 2 and the cooling mechanism 3 respectively, and set an isolation chamber at the inlet and outlet of the airtight cabin 1 respectively 4. Prevent the air in the external environment from directly entering the airtight chamber 1 without drying and temperature control regulation, thereby affecting the test temperature and test environment of the temperature control test bench 53;

[0039] Step 2, adjust the temperature of the temperature control test bench 53; through the cooling plate 531 and the heating plate 532 in the temperature control device, comprehensively control and adjust the temperature of the temperature control test bench 53, so that the temperature of the temperature control test bench 53 is constant at the set...

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Abstract

The invention provides a chip temperature control test board which comprises an operation table arranged on a rack, a sealed cabin is arranged on the operation table; a drying mechanism and a coolingmechanism which are connected with the sealed cabin are arranged at one end of the sealed cabin; the sealed cabin is internally provided with a test mechanism, the test mechanism comprises a pluralityof temperature control test benches, each temperature control test bench comprises a temperature control device arranged in the sealed cabin, the temperature control device is provided with a heat insulation plate, the heat insulation plate is provided with a test carrying table, and the test carrying table is provided with a test area. The chip temperature control test board provided by the invention is convenient to operate and stable in temperature control, and can regulate and control the temperature of the test platform and the test environment.

Description

technical field [0001] The invention relates to the field of mechanical processing, in particular to the technical field of chip testing, in particular to a chip temperature control test bench and a temperature control test method thereof. Background technique [0002] In the process of chip processing and testing, it is necessary to test the performance parameters of the chip in different ambient temperatures. Usually, a heating device is used to adjust the temperature of the test bench or the testing environment, and then monitor the chip parameters. [0003] For example, patent application number: CN110824339A, patent name: a constant temperature control device and method for switching chip aging screening test, discloses a constant temperature control device and method for switching chip aging screening test, the device includes: chip test socket, It is integrated with a thermocouple acquisition head; the temperature collector is connected with the thermocouple acquisiti...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G05D27/02
CPCG01R31/2875G01R31/2877G01R31/2862G01R31/2868G05D27/02
Inventor 宋玉华葛宏涛李珂
Owner SUZHOU MAKING INTELLIGENT EQUIP CO LTD
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