Side polishing process for LCD planar target material
A planar target and process technology, which is applied in the direction of surface polishing machine tools, grinding/polishing equipment, manufacturing tools, etc., can solve the problems of roughness without introduction, achieve stable roughness, increase turnover rate, and reduce defective products.
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Embodiment 1
[0026] The side polishing process of the LCD planar target in this embodiment is as follows: apply the IPA solution to an 800# alumina scouring pad, and polish the side of the G8.5 split-type LCD planar aluminum target for 1 hour.
[0027] Wherein, the dosage of IPA solution is 80mL, and it is used three times, and the dosage is the same each time.
[0028] Using the polishing process of this embodiment, the polishing time is 1 h, the roughness after polishing is 2-3, and the product yield is 95%.
Embodiment 2
[0030] The side polishing process of the LCD planar target in this embodiment is as follows: apply the IPA solution to an 800# alumina scouring pad, and polish the side of the G8.5 split-type LCD planar aluminum target for 0.9h.
[0031] Among them, the dosage of IPA liquid is 90mL, and it is used three times, and the dosage is the same each time.
[0032] Using the polishing process of this embodiment, the polishing time is 0.9 h, the roughness after polishing is 2-3, and the product yield is 94%.
Embodiment 3
[0034] The side polishing process of the LCD planar target in this embodiment is as follows: apply the IPA solution to an 800# alumina scouring pad, and polish the side of the G8.5 split-type LCD planar aluminum target for 0.8h.
[0035] Wherein, the dosage of IPA liquid is 100mL, and it is used three times, and the dosage is the same each time.
[0036] Using the polishing process of this embodiment, the polishing time is 0.8 h, the roughness after polishing is 2-3, and the product yield rate is 95%.
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