Semi-automatic solder paste printer

Abstract

The invention relates to the technical field of printers and discloses a semi-automatic solder paste printer. The semi-automatic solder paste printer comprises a supporting seat and an air pump. A rotary supporting seat is fixedly mounted on the top of the supporting seat, a sliding groove is formed in the rotary supporting seat, a center shaft is movably connected to the middle of the rotary supporting seat in a sleeved manner, and the bottom of the center shaft is fixedly connected to a servo motor. By arranging a rotating disc, a fixing device and a screen plate, a scraper moves circularly,so that the scraper and an annular steel mesh are kept in contact continuously to further ensure that the pressure between the scraper and the annular steel mesh is kept in a certain amplitude range,the pressure fluctuation is reduced, it is ensured that the amounts of solder paste passing through the steel mesh are equal, and the solder paste printing quality of PCB bonding pads of a same batchis improved. Meanwhile, by arranging a worktable which is matched with the scraper, the scraper prints the PCB bonding pads on the worktable successively in a rotating process, so that the scraper returning time is shortened and the printing efficiency is improved.

Description

technical field [0001] The invention relates to the technical field of printing machines, in particular to a semi-automatic solder paste printing machine. Background technique [0002] Surface Mount Technology (SMT for short) has been widely used for its advantages of easy automated production, high assembly density, small size, good high-frequency characteristics, and low cost, and solder paste printing is at the forefront of the SMT process and is the key to the entire SMT process. One of the key processes in the process, the semi-automatic solder paste printing machine has simple structure, convenient operation, and low price, and has been widely used, but the semi-automatic solder paste printing machine still has the following deficiencies, as follows: [0003] The pressure between the squeegee and the stencil is an important parameter for the quality of solder paste printing. If the pressure is too small, the amount of solder paste on the PCB pad will be insufficient or...

AI Technical Summary

Problems solved by technology

[0003] The pressure between the squeegee and the stencil is an important parameter for the quality of solder paste printing. If the pressure is too small, the amount of solder paste on the PCB pad will be insufficient or even the solder paste will be off-printed. If the pressure of the squeegee is too high, the solder paste on the pad will be damaged. If the paste is too thin, it may even damage the stencil. In production, the scraper needs to be repeatedly separated from the stencil and then in contact again. As a result, the pressure between the scraper and the stencil cannot be kept consistent during repeated contact, and there is a certain deviation, which will lead to PCB board The amount of solder paste on the pad is different, so that the quality of subsequent soldering is different, resulting in a decline in product quality. At the same time, the scraper moves back and forth above the steel mesh. After scraping once, it needs to return to its position and spread the solder paste Uniformity, the reciprocating movement of the scraper causes insufficient printing efficiency, and its transmission structure is relatively complicated, which requires high positioning accuracy

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