Plasma degumming machine

Abstract

The invention relates to the technical field of plasma degumming machine equipment, and particularly relates to a plasma degumming machine. The plasma degumming machine comprises a machine box, wherein a radio frequency power supply, a heating plate, a placing assembly and an ionization assembly are sequentially arranged in the machine box from bottom to top; a vacuumizing assembly used for vacuumizing the interior of the machine box is arranged on the left side wall of the machine box; a filtering circulation assembly used for circulating hot air flow generated in the machine box is arrangedon the right side wall of the machine box; and an air supply assembly used for supplying air to the interior of the ionization assembly is arranged at the top of the machine box. According to the plasma degumming machine, through the design and use of a series of structures, in the using process, the problems that on one hand, the degumming effect is poor due to uneven heating, and on the other hand, the surface of a wafer is damaged due to a large number of high-energy active particles generated in the ionization process are solved, so that the practicability of the plasma degumming machine is improved.

Description

technical field [0001] The invention relates to the technical field of plasma degumming machine equipment, in particular to a plasma degumming machine. Background technique [0002] The plasma degumming machine can be used for monolithic gluing of 2 to 6-inch semiconductor wafers. By generating low-pressure, low-temperature plasma glow discharge, it has a rapid chemical reaction and physical impact with the surface of the wafer to complete the degumming. The top-down plasma deglue mode prevents the wafer from being damaged by high-energy ions. [0003] In the process of using the plasma degumming machine in the prior art to degumming the wafer, on the one hand, uneven heating will lead to poor degumming effect; Damage to the surface reduces the usefulness of the plasma stripper. [0004] Therefore urgently need to develop a kind of plasma degumming machine to solve the above problems. Contents of the invention [0005] Aiming at the deficiencies of the prior art, the pr...

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Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a plasma degumming machine. Through the design and use of a series of structures, the present invention solves the problem of poor degumming effect caused by uneven heating on the one hand, and poor degumming effect on the other hand. On the one hand, a large number of high-energy active particles generated during the ionization process will cause damage to the surface of the wafer, thereby improving the practicability of the plasma degumming machine

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