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A kind of copper-based diamond gradient heat dissipation material and its preparation method

A technology of heat dissipation material and single crystal diamond, which is applied in cladding optical fiber, optical waveguide and light guide, etc., can solve the problems of damaged diamond thermal conductivity, limited thermal conductivity, and failure to achieve the expected effect, so as to ensure matching degree and guarantee processing The effect of accuracy and cooling efficiency

Active Publication Date: 2022-01-04
CHANGSHA ADVANCED MATERIALS IND RES INST CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

The composite materials in the prior art greatly compromise the excellent thermal conductivity of diamond itself, and the thermal conductivity increased on the basis of the metal itself is limited
In addition, another problem is encountered. The methods in the prior art are generally used in the preparation of planar heat dissipation components. When used in the field of optical fiber heat dissipation, the expected effect is far from being achieved.

Method used

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  • A kind of copper-based diamond gradient heat dissipation material and its preparation method
  • A kind of copper-based diamond gradient heat dissipation material and its preparation method
  • A kind of copper-based diamond gradient heat dissipation material and its preparation method

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Effect test

Embodiment 1

[0038] In this embodiment, red copper is used as the raw material, single crystal diamond particles with a particle size of 100 μm are used as the diamond raw material, and copper powder with a particle size D50 of 20 μm is used as the sintering raw material. The specific steps are:

[0039] (1) Process the red copper into a semi-circular groove;

[0040] (2) Uniformly hot-press the single crystal diamond on the inner wall of the semi-circular copper groove, and the hot-pressing temperature is 800°C;

[0041] (3) Copper powder is filled in the gap of diamond particles, and compacted with a mold;

[0042] (4) Sintering at a high temperature of 900°C forms a copper-based diamond gradient heat dissipation material assembly.

[0043] After inspection, the thermal conductivity of the diamond-copper composite layer is 592W / m.k.

Embodiment 2

[0045] In this embodiment, red copper is used as the raw material, single crystal diamond particles with a particle size of 150 μm are used as the diamond raw material, and copper powder with a particle size D50 of 50 μm is used as the sintering raw material. The specific steps are:

[0046] (1) Process the red copper into a semi-circular groove;

[0047] (2) Uniformly hot-press the single crystal diamond on the inner wall of the semi-circular copper groove, and the hot-pressing temperature is 750°C;

[0048] (3) Copper powder is filled in the gap of diamond particles, and compacted with a mold;

[0049] (4) Sintering at a high temperature of 850°C forms a copper-based diamond gradient heat dissipation material assembly.

[0050] After inspection, the thermal conductivity of the diamond-copper composite layer is 581W / m.k.

Embodiment 3

[0052] In this embodiment, red copper is used as the raw material, single crystal diamond particles with a particle size of 100 μm are used as the diamond raw material, and copper powder with a particle size D50 of 20 μm is used as the sintering raw material. The specific steps are:

[0053] (1) Process the red copper into a semi-circular groove;

[0054] (2) uniformly hot-press the single crystal diamond on the inner wall of the semi-circular copper groove, and the hot-pressing temperature is 850°C;

[0055] (3) Copper powder is filled in the gap of diamond particles, and compacted with a mold;

[0056] (4) Sintering at a high temperature of 950°C forms a copper-based diamond gradient heat dissipation material assembly.

[0057] After inspection, the thermal conductivity of the diamond-copper composite layer is 610W / m.k.

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Abstract

The invention relates to the field of heat dissipation materials, in particular to a copper-based diamond gradient heat dissipation material and a preparation method thereof. The copper-based diamond gradient heat dissipation material component is in the shape of a semi-circular groove, the inner wall is a diamond-copper composite layer, and the outer wall is a copper layer. A method for preparing the assembly is also provided. Through this solution, the matching degree between the gradient heat dissipation material and the curved surface of the optical fiber is ensured, and the processing accuracy and heat dissipation efficiency are guaranteed. At the same time, it overcomes the shortcomings of conventional copper and diamond composite materials, which are difficult to process and difficult to form a uniform curved surface.

Description

technical field [0001] The invention relates to the field of heat dissipation materials, in particular to a copper-based diamond composite material component and a preparation method of the composite material component. Background technique [0002] The functional requirements of various devices in the fields of electronics, aerospace, military, industry, and medical treatment are getting higher and higher, and the power density of correlators (parts) is also increasing, which brings greater difficulty and difficulty to heat dissipation. higher challenge. Especially in the military and aerospace fields, devices with high power density or high assembly density emit a lot of heat when they work. If the heat is not dissipated in time, it will greatly increase the failure rate and failure rate of power devices. High thermal conductivity diamond / copper composite materials have a very wide range of applications, such as clamping rods for high-power traveling wave tubes (satellit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C22C1/10C22C9/00C22C26/00G02B6/02
CPCC22C1/10C22C9/00C22C26/00G02B6/02
Inventor 黄翀苗建国
Owner CHANGSHA ADVANCED MATERIALS IND RES INST CO LTD
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